EDA Chip Design Automation for Temperature and EMI Stabilization
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Solution Overview
Problem
Current chip design methods face challenges in achieving environmental stability, particularly in temperature and electromagnetic environments, due to the trade-off between temperature range and electrical performance, leading to increased design difficulty and the need for manual intervention in adding temperature-compensated circuits and electromagnetic shielding.
Innovation Solution
A chip design method utilizing secondary development capability of EDA software to automatically add environmental stabilization systems, including temperature compensation and electromagnetic shielding, by preconfiguring function modules, inputting environmental parameters, and calculating necessary parameters for heat generation and metal layer dimensions, allowing for optimized schematic diagrams and layouts without altering the original chip design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If temperature compensation circuits are manually added to extend operating temperature range, then environmental adaptability is improved, but device complexity and design difficulty increase
Solution Approach 1:
The EDA software preconfigures temperature compensation function modules and automatically generates the necessary circuits and layouts before the design is finalized. This preliminary automation of what would otherwise require manual design and implementation reduces the complexity burden on designers while ensuring proper temperature compensation is integrated into the chip design.
2Object-affected harmful factors
If electromagnetic shielding measures are added during packaging and circuit board design, then electromagnetic resistance is improved, but device complexity and design time increase
Solution Approach 1:
The EDA software automatically generates electromagnetic shielding configurations and metal layer designs during the chip design phase itself, rather than requiring separate packaging and circuit board design interventions. This preliminary action saves significant design time and integrates shielding directly into the chip structure.
3Stability of the object's composition
If manual design optimization is performed for various temperature conditions, then temperature stability is improved, but productivity decreases
Solution Approach 1:
The EDA software performs automated optimization of temperature compensation parameters and circuit configurations based on the input operating environment conditions. The system serves itself by automatically calculating and adjusting the temperature compensation without requiring manual design iterations, thereby maintaining temperature stability while significantly improving design productivity.
4Reliability
If comprehensive environmental considerations are integrated into chip design, then reliability in severe environments is improved, but device complexity increases
Solution Approach 1:
The EDA software extracts and separates the environmental stabilization functions (temperature compensation and electromagnetic shielding) as independent automated modules. This extraction allows the core chip design to remain focused on primary functionality while the environmental adaptations are automatically generated and integrated, reducing the perceived complexity for designers while ensuring comprehensive reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces design complexity and time, enabling chips to function stably in more severe temperature and electromagnetic environments than originally designed for, while maintaining the original chip layout and design efficiency.
Implementation Method 1
a heating circuit 22 based on a silicon substrate and resistors
Implementation Method 2
addition of a metal layer, shielding by grounding
Data Source
AI summary
The present application discloses a chip design method using secondary development capability of EDA software. On the basis of a chip having design and verification of a main function being completed, the feature steps comprise: customizing and adding, on an EDA software development platform, parameters required for an operating environment corresponding to the chip, automatically adding a schematic diagram of at least one of an environmental stabilization system used for implementing temperature compensation and an environmental stabilization system used for implementing electromagnetic shielding, combining same with a chip schematic diagram and drawing to obtain a layout. According to the method, the optimization operation of adding an environmental stabilization system is separated from design of the main function of the chip, and on the basis that design and verification of the main function of the chip are completed and the original chip design layout is kept with few changes, the secondary development capability of EDA software is used for separately optimizing and automatically adding the environmental stabilization system to the original chip design layout; thus, the difficulty and time consumption in chip design are reduced to the greatest extent, and the chip can obtain the capability of normally implementing functions in temperatures and electromagnetic environments that are more severe than those expected in the original design.