Edge Active Optical Coupler for Silicon Photonics Packages
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Solution Overview
Problem
Current semiconductor packaging solutions, particularly in photonics, face challenges with optical coupling due to the complexity of connecting optical fiber connectors under a heatsink, which complicates maintenance and assembly, and there is a need for reliable and efficient optical coupling mechanisms that facilitate easy access and monitoring of optical signals.
Innovation Solution
The implementation of active optical couplers that are physically and electrically coupled with the substrate, allowing for optical coupling at the edge of the photonics package, with features like alignment pins and retention mechanisms, and integrated photonics circuitry for monitoring and telemetry, along with adapters that extend the optical pathway and provide structural rigidity, enabling efficient optical signal transmission and monitoring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fiber connectors are connected under the heatsink, then optical coupling is achieved, but maintenance and assembly become complicated
Solution Approach 1:
The optical coupler is extracted from the traditional location under the heatsink and repositioned to the edge of the photonics package. This extraction allows the optical fiber connectors to be accessed from the side rather than requiring disassembly of the heatsink, thereby maintaining optical coupling reliability while significantly improving maintenance and assembly ease.
Solution Approach 2:
The optical coupling interface is moved from a vertical arrangement (under the heatsink) to a horizontal arrangement (at the edge of the package). This dimensional change allows operators to access connectors from the side without removing the heatsink, resolving the contradiction between reliable optical coupling and ease of maintenance.
2Loss of information
If active optical couplers with integrated circuitry are implemented, then optical signal monitoring is enabled, but device complexity increases
Solution Approach 1:
The optical coupler is merged with photonics circuitry and electrical circuitry to create an integrated active optical coupler. This combination enables optical signal monitoring and telemetry functions within the coupler itself, allowing real-time monitoring of optical signals without requiring separate monitoring systems, thus reducing overall system complexity despite the added functionality.
Solution Approach 2:
The active optical coupler is designed with multi-functionality, serving both as an optical coupling device and as a monitoring device. The integrated photonics circuitry enables the coupler to perform optical signal transmission and monitoring functions simultaneously, reducing the need for separate components and minimizing device complexity.
3Manufacturing precision
If alignment pins and retention mechanisms are added, then assembly precision is improved, but manufacturing complexity increases
Solution Approach 1:
Alignment pins are pre-positioned on the optical coupler before final assembly. These pins protrude from the coupler body and automatically guide the optical fiber connectors into proper alignment during assembly, ensuring precise optical alignment without requiring complex adjustment procedures or additional manufacturing steps.
Solution Approach 2:
The alignment pins and retention mechanisms are designed to automatically perform alignment and securing functions during assembly. The retention mechanisms engage with the connectors to hold them in place, providing self-aligning and self-securing capabilities that simplify the assembly process while maintaining high precision.
Data Source
AI summary
Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.