Edge-Aligned IC Package Template for Thermal and Mechanical Integrity
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Solution Overview
Problem
Existing integrated circuit packages face challenges in achieving optimal mechanical, thermal, and electrical performance due to misalignment of thermo-mechanical structures and limitations of dielectric materials, leading to manufacturing constraints and reduced integration density.
Innovation Solution
A base template with openings is used to align and attach integrated circuit devices, filled with thermally conductive and structurally rigid materials, providing improved thermal paths and mechanical strength, while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermo-mechanical structures are used to provide thermal paths and mechanical integrity, then thermal performance and mechanical strength are improved, but manufacturing precision deteriorates due to misalignment from placement and dicing tolerances
Solution Approach 1:
The template structure is prepared in advance with pre-formed openings positioned at precise locations. The base die is then attached to the template before the active device is mounted, ensuring that the active device opening aligns with the pre-positioned template opening. This preliminary structuring eliminates alignment issues that would otherwise occur during subsequent assembly steps.
Solution Approach 2:
The template structure serves as an intermediary component between the base die and the active device. It provides a stable, pre-positioned framework that mediates the alignment between components, allowing precise positioning of the active device opening relative to the base die bonding pads without requiring high-precision alignment during final assembly.
2Reliability
If dielectric material is used to fill extra space around active devices, then electrical connectivity is maintained, but thermal conductivity deteriorates and mechanical strength is reduced
Solution Approach 1:
Different regions of the package are assigned different materials with optimized properties for their specific functions. The template structure uses thermally conductive material in regions requiring heat dissipation, while dielectric material is used only where electrical insulation is needed. This local differentiation allows simultaneous optimization of thermal and electrical properties in different areas.
Solution Approach 2:
The package employs composite construction with multiple material types: thermally conductive material for the template structure to provide thermal paths, dielectric material for electrical insulation where needed, and conductive epoxy for electrical connections. This composite approach allows each material to be used where its specific properties are most beneficial, resolving the contradiction between electrical connectivity and thermal conductivity.
3Ease of manufacture
If conventional stacking methods are used with misaligned thermo-mechanical structures, then manufacturing is simplified, but integration density deteriorates due to uncovered areas requiring mold or oxide materials
Solution Approach 1:
The template structure is pre-formed with openings positioned to exactly match the required active device locations. This preliminary positioning ensures that when devices are mounted, they align perfectly with the template openings, eliminating the need for additional mold or oxide materials to fill gaps, thereby maximizing integration density without complicating manufacturing.
Solution Approach 2:
The template structure serves multiple functions simultaneously: it provides mechanical support, defines precise positioning for active devices, creates thermal paths through its thermally conductive material, and eliminates the need for separate fill materials. This multi-functionality achieves high integration density while maintaining manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal conductivity, mechanical integrity, and electrical performance by aligning integrated circuit devices, allowing for finer pitched interconnections and increased integration density.
Implementation Method 1
filled with thermally conductive and structurally rigid materials, providing improved thermal paths
Data Source
AI summary
Integrated circuit assemblies can be fabricated on a wafer scale, wherein a base template, having a plurality of openings, may cover a base substrate, such as a die wafer, wherein the base substrate has a plurality of first integrated circuit devices formed therein and wherein at least one second integrated circuit device is electrically attached to a corresponding first integrated circuit device through a respective opening in the base template. Thus, when the base substrate and base template are singulated into individual integrated circuit assemblies, the individual integrated circuit assemblies will each have a first integrated circuit that is edge aligned to a singulated portion of the base template. The singulated portion of the base template can provide an improved thermal path, mechanical strength, and/or electrical paths for the individual integrated circuit assemblies.