Edge-Aligned Vertical Conduction for Electro-Optical Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electro-optical devices face challenges in achieving adequate vertical conduction due to design errors and size constraints, leading to display defects and reduced image quality, especially as device sizes decrease.
Innovation Solution
The electro-optical device incorporates a vertical-conduction electrode in the sealing region that extends along the edge of the element substrate, allowing for electrical conduction between substrates, reducing the space required for conduction elements, and increasing design flexibility, while also functioning as a light-blocking film to simplify manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vertical-conduction terminals and vertical-conduction members are disposed at the corners of substrates, then electrical conduction between substrates is achieved, but the peripheral region size increases and design errors may occur
Solution Approach 1:
The patent moves the vertical-conduction terminals from corner positions (0D point) to edge positions (1D line), and the vertical-conduction members from discrete corner locations to continuous edge-aligned structures. This dimensional transition allows the conduction paths to extend along the edges, reducing the required peripheral area while maintaining conduction reliability through distributed contact points along the sealing region.
Solution Approach 2:
The vertical-conduction members are designed to serve dual functions: providing electrical conduction between substrates and acting as light-blocking structures. By integrating these functions into a single component disposed along the edge, the patent reduces the number of separate elements needed, thereby minimizing the peripheral region area while ensuring both conduction reliability and optical performance.
2Volume of moving object
If device size is reduced, then compactness is improved, but design errors in vertical-conduction configuration occur more often
Solution Approach 1:
The patent pre-establishes the vertical-conduction paths by aligning the terminals and members along the edge regions before final assembly. This preliminary positioning ensures that even in miniaturized devices, the conduction paths are predetermined and less susceptible to manufacturing variations, thereby maintaining configuration precision while reducing overall device volume.
Solution Approach 2:
The vertical-conduction system is segmented into multiple distributed contact points along the edge-aligned terminals and members, rather than relying on a single corner connection. This segmentation provides redundancy and reduces sensitivity to manufacturing errors, allowing compact device design without sacrificing conduction reliability.
3Area of stationary object
If sealing region and vertical-conduction elements space is reduced, then device compactness is improved, but adequate vertical conduction becomes difficult to achieve
Solution Approach 1:
The patent merges the sealing region and vertical-conduction paths by disposing the terminals and members along the edges within or adjacent to the sealing region. This integration eliminates the need for separate dedicated spaces for sealing and conduction, achieving compactness while maintaining adequate vertical conduction through the shared edge-aligned structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances vertical conduction reliability, reduces display defects, and enables high-quality image display even in smaller device sizes by minimizing the peripheral region and integrating conduction and light-blocking functions.
Implementation Method 1
a vertical-conduction member provided in the sealing region and electrically connected to the vertical-conduction electrode and the opposing electrode
Implementation Method 2
an electro-optical material is held between a pair of an opposing substrate and an element substrate
Data Source
AI summary
An electro-optical device includes a pair of an opposing substrate and an element substrate, pixel electrodes, a sealing member, an opposing electrode, a vertical-conduction electrode, and a vertical-conduction member. The opposing substrate and element substrate are bonded with the sealing member so as to oppose each other. The pixel electrodes are arrayed on the element substrate in a pixel region. The sealing member is provided in a sealing region located around the pixel region. The opposing electrode is provided on the opposing substrate so as to oppose the pixel electrodes. The vertical-conduction electrode is formed in the sealing region extending along at least one edge of the element substrate. The vertical-conduction member is provided in the sealing region and electrically connected to the vertical-conduction electrode and the opposing electrode.