Edge Band Structure for Plasma-Resistant Substrate Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate processing apparatuses face challenges with durability due to wear and contamination from plasma exposure, leading to frequent replacement of components like edge rings.
Innovation Solution
The substrate processing apparatus incorporates a design with a body portion, substrate arrangement portion, bonding portion, and edge bands that enhance durability by preventing plasma etching of critical components and improving the fixing force of edge bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are exposed to plasma during substrate processing, then the plasma processing function is achieved, but the components suffer from wear and contamination leading to reduced durability
Solution Approach 1:
The patent introduces an edge band as an intermediary component between the edge ring and the substrate arrangement portion. This edge band acts as a mediator that absorbs plasma exposure and chemical reactions, protecting the bonding portion and edge ring from direct plasma contact. The edge band is specifically designed to be replaceable and resistant to plasma-induced wear, thereby resolving the contradiction between maintaining plasma processing functionality and preventing component degradation.
Solution Approach 2:
The patent applies the disposable principle by making the edge band a replaceable component. The edge band is designed to be consumed or replaced periodically when it shows signs of wear or contamination, while the more expensive bonding portion and edge ring are protected from direct plasma exposure. This allows the system to maintain high reliability by replacing only the sacrificial edge band rather than the entire edge ring assembly.
2Reliability
If the edge ring is periodically replaced to maintain performance, then contamination is managed, but the apparatus requires frequent maintenance and component replacement
Solution Approach 1:
The patent segments the edge ring assembly into multiple independent components: the edge ring, the bonding portion, and the edge band. This segmentation allows the edge band to be replaced independently without replacing the entire edge ring or bonding portion. The edge band can be quickly swapped out during maintenance periods, significantly reducing the time required for component replacement while maintaining the performance benefits of regular maintenance.
3Productivity
If the bonding portion is exposed to plasma, then the plasma process is effective, but the bonding portion suffers from chemical reactions leading to wear
Solution Approach 1:
The edge band serves as a protective intermediary positioned between the plasma environment and the bonding portion. During plasma processing, the edge band absorbs the brunt of plasma exposure and chemical reactions, while the bonding portion remains relatively protected. This allows the plasma process to remain effective on the substrate while extending the lifespan of the bonding portion by preventing direct plasma-induced degradation.
Data Source
AI summary
A substrate processing apparatus is provided. A substrate processing apparatus comprising a body portion, a substrate arrangement portion disposed on the body portion, a bonding portion disposed between the substrate arrangement portion and the body portion, connecting the substrate arrangement portion with the body portion, a first hole installed in the substrate arrangement portion, having a first diameter, a second hole installed in the bonding portion, having a second diameter larger than the first diameter, a first edge band installed in the second hole and installed to be in contact with a lower surface of the substrate arrangement portion, a side surface of the bonding portion, and an upper surface of the body portion and a lifting pin installed to extend through the first hole, the second hole and the first edge band.