Edge Bead Removal Nozzle X-Y Control for Precise Substrate Coating
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Solution Overview
Problem
Existing edge bead removal methods struggle with precise control of edge bead removal nozzles, especially when required to handle smaller edge bead sizes, leading to contamination and defocusing issues during semiconductor substrate processing.
Innovation Solution
The method involves setting initial position coordinates of the edge bead removal nozzle to both X-axis and Y-axis values, adjusting the removal region using cosine values based on these coordinates, and rotating the substrate while discharging the removal liquid to precisely control the edge bead removal process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If only Y-axis motion is used for EBR nozzle control, then the device complexity is reduced, but the manufacturing precision deteriorates when handling smaller edge bead sizes
Solution Approach 1:
The patent transitions from one-dimensional (Y-axis only) nozzle motion control to two-dimensional (X-Y axis) motion control. By introducing X-axis coordinate control alongside the existing Y-axis control, the system gains the ability to precisely position the nozzle at any location along the substrate edge, enabling accurate removal of smaller edge beads while maintaining manageable device complexity through systematic coordinate management.
2Ease of operation
If the EBR nozzle position is not precisely controlled, then the ease of operation is improved, but the reliability deteriorates due to contamination and defocusing issues
Solution Approach 1:
The patent implements a feedback mechanism where the controller receives coordinate information (X and Y axes) about the nozzle position and substrate rotation state, then adjusts the nozzle motion and liquid discharge timing accordingly. This closed-loop control ensures the nozzle remains precisely positioned relative to the rotating substrate edge, preventing contamination and defocusing while maintaining ease of operation through automated control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for precise adjustment of the edge bead removal region, ensuring effective removal of edge beads without causing contamination or defocusing, thereby enhancing the reliability of semiconductor processing.
Implementation Method 1
A photosensitive film may be applied by supplying a photosensitive resin composition to a substrate and spinning the substrate. In this case, the photosensitive resin composition may be concentrated at an edge (E) of the substrate by centrifugal force.
Data Source
AI summary
The present disclosure provides an edge bead removal method in which initial position coordinates of an edge bead removal nozzle are set to both an X-axis value and a Y-axis value, a substrate treatment apparatus performing the same, and a substrate treatment method. The substrate treatment apparatus includes a first unit performing a coating process of forming a film on a substrate, and a controller controlling the first unit. The coating process includes a liquid supply operation of supplying a first liquid to the rotating substrate to form the film on the substrate, and an edge bead removal (EBR) operation of supplying a second liquid to the rotating substrate to remove a portion of the film formed in an edge region of the substrate.