Edge Zone Coating Removal with Warpage-Compensated Etching
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for removing coatings from the edge of substrates in semiconductor fabrication are inefficient, often resulting in non-linear edges due to substrate warpage, and can cause defects or require expensive and hazardous equipment.
Innovation Solution
An apparatus with a multi-head nozzle assembly that includes sensors to measure substrate warpage and adjust nozzle positions to maintain a straight edge during etching, using angled streams of etchant and gas shrouds to control the etching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser or plasma ablation is used to remove coatings from substrate edges, then coating removal can be achieved, but the method results in non-linear edges due to substrate warpage and requires expensive safety equipment
Solution Approach 1:
The patent replaces laser or plasma ablation systems with a mechanical jet etching system that uses pressurized gas jets to remove coatings. This substitution eliminates the need for expensive laser safety equipment and ventilation systems while providing better control over the etching process to maintain edge linearity despite substrate warpage
Solution Approach 2:
The patent uses sensors to detect substrate warpage and creates a digital map of the substrate surface topology. This information is then used to dynamically adjust the nozzle positions, effectively copying the substrate's warpage profile and compensating for it to maintain straight edge lines
2Manufacturing precision
If traditional laser coating removal methods are used, then coatings can be removed, but fragile thin substrates (200-250 micron) risk breaking
Solution Approach 1:
The patent replaces high-energy laser ablation with a mechanical jet etching system using pressurized gas. This method applies controlled mechanical force through gas jets that can be precisely regulated, allowing coating removal without the thermal stress and risk of breaking fragile thin substrates
Solution Approach 2:
The patent implements dynamic control of the jet etching process where nozzle positions are continuously adjusted based on real-time substrate warpage measurements. This dynamic adaptation allows the system to maintain optimal etching conditions while accommodating substrate variations, preventing stress concentration that could lead to substrate breakage
3Manufacturing precision
If multiple passes are used for satisfactory coating removal with laser ablation, then coating can be removed, but the process becomes time-consuming and requires subsequent cleaning steps
Solution Approach 1:
The patent changes the fundamental parameter of the etching process by using pressurized gas jets instead of laser energy. This allows for higher material removal rates in a single pass while producing cleaner edges that minimize redeposition, eliminating the need for multiple passes and subsequent cleaning steps
Solution Approach 2:
The substitution of laser ablation with mechanical jet etching provides more controlled and efficient coating removal. The pressurized gas jets can be optimized for specific coating materials, achieving complete removal in fewer passes with less redeposition, thereby increasing overall processing speed and productivity
4Manufacturing precision
If laser ablation is used to remove metal coatings, then coating removal is achieved, but large amounts of energy are needed making the process inefficient
Solution Approach 1:
The patent replaces energy-intensive laser ablation with a mechanical jet etching system that uses pressurized gas. This substitution dramatically reduces energy consumption by using mechanical kinetic energy from gas flow instead of high-power laser energy, while maintaining effective coating removal capability
Solution Approach 2:
The patent employs pneumatic principles by using pressurized gas jets to remove coatings. This approach leverages the kinetic energy of compressed gas to achieve coating removal with significantly lower energy input compared to laser methods, improving energy efficiency while maintaining effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves precise and repeatable removal of coatings with straight edges, minimizing defects and reducing the risk of substrate breakage, while being cost-effective and safer than traditional methods.
Implementation Method 1
The at least one nozzle tip may be configured to direct an angled stream of an etchant to impinge on the coated surface of the substrate received in the cavity
Implementation Method 2
one or more sensors configured to measure a warpage of the substrate along at least a portion of the length of the substrate
Implementation Method 3
a controller configured to move at least one nozzle-head of the one or more nozzle-heads in a second direction orthogonal to the first direction based on the measured warpage
Data Source
AI summary
An apparatus to remove at least a portion of a coating from a coated surface of a substrate may include a nozzle assembly and one or more nozzle-heads. Each nozzle-head may include at least one nozzle tip and a cavity configured to receive a portion of the coated surface of the substrate. The nozzle tip may be configured to direct an angled stream of an etchant on the substrate as the nozzle assembly moves along the length of the substrate. One or more sensors may measure a warpage of the substrate along the length of the substrate, and a controller may move the nozzle-head orthogonal to the direction of nozzle-head movement based on the measured warpage.