Edge Detection Coil Layout for Multi-Direction Crack Sensing
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Solution Overview
Problem
Current crack detection methods in the cutting process of substrates like wafers and glass are limited by unidirectional crack detection lines, which fail to detect cracks not intersecting these lines, resulting in low precision and reliability.
Innovation Solution
A crack detection circuit with a detection coil arranged around the edge of a substrate, featuring multiple detection sections extending in different directions to form a closed-loop circuit, allowing for the detection of cracks in various orientations by breaking under tensile stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate detection device is used to detect cracks in the light-shielding film, then crack detection capability is provided, but the device structure becomes more complex and cost increases
Solution Approach 1:
The patent combines the crack detection function with the existing display device by integrating a detection circuit into the driver circuit structure. The detection circuit shares the gate line structure and uses the same TFT switches and capacitors that already exist in the display driving architecture, thereby achieving crack detection without adding separate independent detection hardware. This merging approach resolves the contradiction by providing detection capability while avoiding increased device complexity.
Solution Approach 2:
The detection circuit is designed to perform multiple functions: it can detect cracks in the light-shielding film, verify the integrity of gate lines, and work alongside the normal display driving function. By making the detection circuit multi-functional and integrating it into the existing driver architecture, the patent avoids the need for separate dedicated detection devices, thus resolving the contradiction between detection capability and device complexity.
2Device complexity
If a detection circuit is integrated into the driver circuit, then device complexity is reduced, but the driving capability may be affected
Solution Approach 1:
The driver circuit is segmented into distinct functional modules: a detection circuit portion and a normal driving circuit portion. The detection circuit uses specific TFT switches (first and second switches) and capacitors dedicated to detection, while the normal driving circuit handles display signal transmission. This segmentation allows both functions to operate independently without interfering with each other, resolving the contradiction by maintaining driving capability while achieving integration.
Solution Approach 2:
The circuit dynamically switches between detection mode and driving mode by controlling the state of specific TFT switches. During normal operation, the driving function is active; during detection, the detection function is activated by changing switch states. This dynamic operation ensures that the integrated circuit can perform both functions at different times without compromising either detection reliability or driving capability.
3Reliability
If crack detection is performed during display operation, then continuous monitoring is achieved, but power consumption increases
Solution Approach 1:
The crack detection is performed periodically by controlling the TFT switches to switch between detection mode and driving mode, rather than continuously operating in detection mode. The detection circuit activates at specific intervals to check for cracks, then returns to normal driving operation. This periodic action provides continuous monitoring capability over time while significantly reducing power consumption compared to continuous detection operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances crack detection precision and efficiency by enabling the detection of cracks in multiple directions, improving the reliability of cut substrate fragments and increasing product yield.
Implementation Method 1
a first capacitor connected between a first node and a second node, the first capacitor to hold a detection signal voltage
Implementation Method 2
a second capacitor connected between a third node and a fourth node, the second capacitor to hold a reference signal voltage
Data Source
Figure 1-1~1-2
Figure 2-1~3-1
Figure 3-2~4-2
AI summary
Embodiments of this application provide an apparatus equipped with a crack detection circuit, including a main body, and a detection control module and a detection coil that are disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically connected to the detection control module, to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections that are sequentially connected head-to-tail, and adjacent detection sections are not collinear. This application further provides a crack detection system. The embodiments of this application implement detection on a crack in any direction on the main body, thereby improving crack detection precision and efficiency.