Edge-Connected IC Package Assembly for Direct Inter-Package Data Links
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Solution Overview
Problem
Designing and manufacturing computer system hardware to meet increasing compute demands while managing data transfer and cooling requirements within space constraints poses significant design and cost challenges, particularly due to the need for frequent redesigns and complex PCB layouts.
Innovation Solution
The implementation of edge-connected integrated circuit packages in a ganged assembly configuration, where each package includes a substrate assembly with edge contacts coupled via package-to-package conductive paths, allowing direct data communication and eliminating the need for supporting circuitry on the PCB, along with flexible cooling solutions and multi-chip connector frames for efficient component placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete processing units are mounted to a PCB with supporting circuitry, then data transfer between processing units is enabled, but PCB design complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the PCB supporting circuitry directly into the integrated circuit packages themselves. Each package includes substrate assembly with embedded conductive paths that eliminate the need for separate PCB trace routing and supporting circuitry. This consolidation reduces PCB design complexity while maintaining data transfer efficiency between processing units.
2Productivity
If high-performance processors are used to meet increasing compute demands, then processing capability improves, but cooling requirements and space constraints increase
Solution Approach 1:
The patent transitions from planar PCB mounting to three-dimensional stacked packaging with vertical interconnects. Multiple processing units are stacked vertically within the same footprint, utilizing the vertical dimension for interconnection. This reduces the horizontal space required and enables more efficient heat dissipation pathways in the vertical direction, addressing both space constraints and cooling requirements.
3Productivity
If frequent redesigns are performed to meet new compute demands, then processing performance improves, but manufacturing expense and technology risk increase
Solution Approach 1:
The patent segments the processing system into independent, modular integrated circuit packages. Each package is a self-contained unit with its own substrate assembly and conductive paths. This modularity allows individual packages to be redesigned and manufactured using new silicon technologies without requiring redesign of the entire system, reducing manufacturing expense and technology risk while enabling performance improvements.
Data Source
AI summary
Edge-connected semiconductor systems are described along with methods of making and using the same. First and second integrated circuit packages are obtained, each including a substrate assembly having top and bottom sides and an edge that extends between the top and the bottom sides. Edge contacts are disposed on the edges of the substrate assemblies. A ganged assembly is formed by establishing conductive paths between the edge contacts of the substrate assemblies. The ganged assembly is coupled to a printed circuit board (“PCB”) by coupling host contacts on one or more of the substrate assemblies to corresponding contacts on the PCB.