Edge Connector Assembly for High Density Memory Stacking
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Solution Overview
Problem
Existing memory module connectors on printed circuit boards face challenges in achieving high packaging density and reliable electrical contact, particularly when stacking memory modules, as they require insertion and rotation, which can lead to contact issues and increased complexity.
Innovation Solution
A memory module connector assembly is secured along the edge of a printed circuit board with multiple edge connector sockets and electrical leads, allowing for efficient electrical connection between the modules and the board, with features like opposing rows of contacts and keys for orientation, ensuring reliable contact and improved accessibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory modules are stacked in close proximity to achieve high packaging density, then packaging density is improved, but electrical contact reliability deteriorates due to insertion and rotation requirements
Solution Approach 1:
The connector assembly is divided into separate upper and lower connector portions, each with independent contact arrays. The electrical leads are segmented into first and second sets that can be independently routed through the PCB, allowing each connector to be optimized for its specific contact reliability requirements while maintaining high packaging density through vertical stacking.
2Quantity of substance
If connectors are stacked at different heights to accommodate multiple memory modules, then packaging density is improved, but device complexity increases
Solution Approach 1:
The upper and lower connector portions are merged into a single integrated connector assembly that is secured to the PCB as one unit. The electrical leads from both connectors are combined and routed through the PCB together, reducing the number of separate assembly operations and simplifying the overall manufacturing process despite the stacked configuration.
3Reliability
If edge connector sockets with contact wipe are used, then electrical contact reliability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The contact wipe mechanism provides a cushioning effect during insertion, where the flexible contacts deform to accommodate minor misalignments between the memory module pads and connector contacts. This beforehand cushioning compensates for manufacturing tolerances and ensures reliable electrical contact even when precision is limited.
Data Source
AI summary
An apparatus includes a memory module connector assembly physically secured along an edge of a printed circuit board. The printed circuit board includes a first plurality of contacts on a first surface of the printed circuit board and a second plurality of contacts on a second surface of the printed circuit board. The memory module connector assembly includes a first edge connector socket for receiving a first memory module, a second edge connector socket for receiving a second memory module, a first plurality of electrical leads electrically connecting contacts within the first edge connector socket to the first plurality of contacts on the first side of the printed circuit board, and a second plurality of electrical leads electrically connecting contacts within the second edge connector socket to the second plurality of contacts on the second side of the printed circuit board.