Edge Connector Signal Density via Multi-Layer PCB Stacking
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Solution Overview
Problem
Current communication modules, such as optical transceivers, face challenges in increasing data throughput and signal density while maintaining a compact size, as they typically have limited dual data paths and require larger edge connectors to accommodate additional data pathways.
Innovation Solution
The design of an edge connector with multiple pairs of differential transmit and receive data signal contact pads arranged in various configurations on a printed circuit board, allowing for increased signal path density without expanding the connector's physical size, by optimizing the placement and number of contact pads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of data paths in a transceiver is increased to handle more data, then data throughput is improved, but the size of the edge connector must increase
Solution Approach 1:
The patent applies dimensionality change by transitioning from a single-layer contact pad arrangement to a multi-layer PCB structure. Multiple pairs of differential data signal contact pads are arranged on different layers of the printed circuit board, allowing vertical stacking of signal paths. This enables increased data throughput through multiple data paths while maintaining the same edge connector footprint, as the additional contact pads utilize the third dimension (vertical layering) rather than expanding the horizontal connector area.
2Productivity
If multiple pairs of differential data signal contact pads are added to increase signal density, then data transfer capability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the edge connector into distinct functional sections: ground contact pads, power contact pads, and multiple pairs of differential data signal contact pads. Each section is independently arranged and can be manufactured separately on different PCB layers. This modular segmentation simplifies the manufacturing process compared to a monolithic design, as each segment can be routed and connected independently through the multi-layer PCB structure.
Solution Approach 2:
The patent resolves manufacturing complexity by utilizing vertical layering in the PCB structure. Multiple pairs of differential data signal contact pads are distributed across different layers, with conductive traces routing signals vertically between layers. This approach to multi-layer arrangement simplifies signal routing and reduces interference compared to attempting to pack all contact pads on a single layer, as the vertical dimension provides natural signal separation and routing paths.
3Quantity of substance
If the number of contact pads is increased to accommodate more data paths, then signal path density is improved, but the edge connector area must expand
Solution Approach 1:
The patent applies the nesting principle by placing multiple pairs of differential data signal contact pads within the same edge connector footprint by utilizing different PCB layers. The contact pads are nested vertically within the connector structure, with each layer containing a subset of the total contact pads. This nested arrangement allows the edge connector to accommodate a high quantity of signal paths without increasing the horizontal area, as additional contact pads are nested within the existing connector boundaries through vertical stacking.
Solution Approach 2:
The patent resolves the area constraint by exploiting the vertical dimension through multi-layer PCB construction. The edge connector maintains a constant footprint area while accommodating increased numbers of signal paths by distributing contact pads across multiple vertical layers. This dimensional transition from 2D to 3D arrangement enables higher signal path density within the same planar area, as the vertical layering provides additional space for contact pads without expanding the connector's horizontal dimensions.
Data Source
AI summary
An edge connector design for use with a printed circuit board included in a communications module is disclosed. In one embodiment, the edge connector comprises a planar surface defining a terminal end of the printed circuit board, and a plurality of conductive contact pads arranged on the planar surface. The contact pads include first and second ground contact pads disposed adjacent opposite side portions of the planar surface and first and second power contact pads disposed proximate a central portion of the planar surface. First and second pairs of differential transmit data signal contact pads, as well as first and second pairs of differential receive data signal contact pads are also included, the pairs being disposed between one of the ground contact pads and one of the power contact pads. The edge connector is received by a female connector of a host device to connect the module to the host.