Edge-Connector Circuit Assembly With Recessed 3D Contacts
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Solution Overview
Problem
Existing encapsulated electronic power converters face challenges in achieving high power density while minimizing mounting area and cost, particularly in integrating inductive components and forming effective electrical connections with insulative materials.
Innovation Solution
A method involving a panel molding process that integrates heat sink panels with contoured surfaces to match component heights, allowing for efficient thermal management and reduced encapsulant volume, along with the use of three-dimensional conductive features and recessed areas for enhanced electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If encapsulant is used to over-mold components for thermal management, then heat conduction is improved, but mounting area and device complexity increase
Solution Approach 1:
The patent combines the encapsulant material with thermal management functionality by integrating heat sinks directly into the molding process. The encapsulant serves dual purposes: protecting components and conducting heat away from them through integrated heat sink structures, thereby improving thermal management without requiring separate mounting areas for thermal components.
Solution Approach 2:
The encapsulant material is designed to perform multiple functions simultaneously: mechanical protection of components, thermal conduction through integrated heat sinks, and structural support. This multi-functionality allows the same material volume to address both protection and thermal management needs, reducing the overall mounting area required.
2Area of stationary object
If power density is increased to reduce mounting area, then device size is reduced, but thermal management and electrical connection complexity increase
Solution Approach 1:
The patent merges thermal management components (heat sinks) directly into the encapsulant structure, eliminating the need for separate thermal management systems. This integration allows high power density components to be thermally managed within the same volume, reducing overall device size while maintaining manageable thermal complexity through unified design.
3Reliability
If insulative material is used for perimeter edges, then electrical isolation is improved, but electrical connection surface area is reduced
Solution Approach 1:
The patent applies local quality by creating recesses in the insulative perimeter edge material at specific locations where electrical connections are needed. The insulative material maintains its electrical isolation properties across the entire perimeter, while localized recesses expose conductive features to create electrical connections. This allows full electrical isolation to be maintained while providing adequate connection surface area at specific points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased power throughput, reduced transformer or inductor losses, and cost-effective production by optimizing thermal performance and electrical connectivity within a compact form factor.
Implementation Method 1
a plurality of conductive features embedded in the surface of the perimeter edge, the conductive features each including an exposed edge, the exposed edges being arranged into one or more contact sets. Each contact set provides an electrical connection to a respective electrical node of the circuit assembly
Implementation Method 2
The additional surface area is recessed from the perimeter edge and together with the adjacent exposed edge forms a three dimensional contact
Data Source
AI summary
Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.