On-chip Edge Coupler Structure for Index-Matching Liquid Filling
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Solution Overview
Problem
Conventional on-chip structures for fiber array alignment using edge coupler index-matching epoxy/oil filling are costly, cumbersome, and inefficient, particularly due to the delicate and precise nature of the epoxy/oil filling process and the difficulty in monitoring the filling quality.
Innovation Solution
The proposed solution involves an on-chip structure with a system comprising edge couplers, main buckets, monitor buckets, and a duct, which facilitates the precise filling of undercuts with index-matching liquids, enhancing fiber coupling efficiency and alignment tolerance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional on-chip structures use edge coupler index-matching epoxy/oil filling for fiber array alignment, then fiber coupling efficiency can be improved, but the process becomes costly, cumbersome, and difficult to monitor
Solution Approach 1:
The invention divides the filling system into separate functional components: a reservoir for storing index-matching liquid, a capillary network for controlled distribution, and monitoring features for quality verification. This segmentation transforms the cumbersome conventional filling process into a manageable, monitorable system while maintaining fiber coupling efficiency.
Solution Approach 2:
The capillary structure acts as an intermediary between the reservoir and the edge coupler undercuts. It enables controlled, automatic distribution of index-matching liquid through capillary action, eliminating the need for delicate manual filling while maintaining reliable fiber coupling.
2Manufacturing precision
If precise epoxy/oil filling is performed in conventional systems, then alignment tolerance is improved, but the process becomes delicate and difficult to monitor
Solution Approach 1:
The invention incorporates monitoring features including air bubbles trapped in the capillary network and reflectivity differences that provide visual feedback on filling status. This enables easy detection and measurement of filling quality without requiring complex monitoring equipment, while maintaining precise alignment tolerance.
Solution Approach 2:
The invention utilizes optical property changes including reflectivity differences and air bubble formation as visual indicators of filling status. These optical changes provide simple, effective monitoring of filling quality without requiring complex measurement systems, while ensuring precise alignment tolerance.
3Reliability
If conventional filling methods are used, then fiber array alignment can be achieved, but the system becomes costly and inefficient
Solution Approach 1:
The invention prepares the filling system in advance by integrating a reservoir and capillary network during chip fabrication. This preliminary action eliminates the need for delicate, time-consuming manual filling operations, significantly improving productivity while maintaining reliable fiber array alignment.
Solution Approach 2:
The capillary network enables self-service filling through automatic capillary action, where the index-matching liquid flows automatically from the reservoir to the edge coupler undercuts without requiring precise manual intervention. This self-service mechanism dramatically improves filling efficiency while ensuring reliable alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively enlarges the mode field diameter, improving fiber coupling efficiency and alignment tolerance, while also simplifying the filling process and enhancing monitoring capabilities.
Implementation Method 1
an on-chip structure with a system comprising edge couplers, main buckets, monitor buckets, and a duct, which facilitates the precise filling of undercuts with index-matching liquids
Data Source
AI summary
Embodiments of the present disclosure may comprise a system for filling undercuts with an index-matching liquid on a wafer, the system comprising a plurality of edge couplers, each comprising an undercut and a waveguide. Embodiments may also comprise ribs that suspend the waveguide over the undercut. Embodiments may also comprise one or more main buckets and one or more monitor buckets. Embodiments may also comprise a duct that couples together the plurality of edge couplers, the one or more main buckets, and the one or more monitor buckets.