Photonics Chip Edge Coupler Structures With Pockels Layers to Reduce Footprint

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Solution Overview

Problem

Photonics chips with thin film lithium niobate (TFLN) suffer from a large footprint and limited power handling capability, particularly in photonic components that utilize an electric-field-induced Pockels effect.

Innovation Solution

A photonics chip structure incorporating an edge coupler and a layer exhibiting an electric-field-induced Pockels effect, utilizing materials like thin film lithium niobate, silicon dioxide, and electrodes to enhance light coupling efficiency and reduce footprint.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If thin film lithium niobate (TFLN) is used in photonic components, then optical properties such as large second-order nonlinearity and low nonlinear absorption are improved, but footprint size increases and power handling capability is limited

Engineering Contradiction:

Improveoptical propertiesVSAvoidfootprint

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from planar photonic component design to three-dimensional vertical stacking, where multiple photonic components are arranged in different layers above the substrate. This vertical dimensionality change allows components to occupy less lateral footprint area while maintaining their optical functionality through the Pockels effect in TFLN layers positioned at different vertical levels.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent implements nested structures where waveguides, modulators, and other photonic components are integrated within each other in a hierarchical manner. For example, modulator regions are positioned within waveguide structures, and multiple functional layers are stacked vertically with each layer containing nested functional elements, maximizing space utilization and reducing overall footprint.

Inventive Principle:

Principle #7Nested doll (Nesting)

2Reliability

Engineering Contradiction:

Improveoptical propertiesVSAvoidpower handling capability

Core Design Contradiction:

ReliabilityVSPower

Solution Approach 1:

The patent divides the photonic circuit into multiple discrete photonic components (waveguides, modulators, couplers, etc.) that are separately fabricated and then integrated through bonding. This segmentation allows each component to be optimized for specific power handling requirements, with high-power components designed separately and combined with low-power TFLN-based modulators, thereby improving overall power handling capability while maintaining optical performance.

Inventive Principle:

Principle #1Segmentation

3Ease of manufacture

If conventional photonic component structures are used, then manufacturing is simpler, but light coupling efficiency is lower and light loss is higher

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidlight loss

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The patent introduces edge couplers as intermediary components that facilitate efficient light coupling between optical fibers and waveguides. These edge couplers are positioned at the edges of the photonic chip and serve as transition structures that match the mode profiles of external optical fibers to the on-chip waveguides, significantly reducing coupling loss while maintaining manufacturing feasibility through standard bonding processes.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The structure improves light coupling efficiency and reduces light loss, thereby enhancing the performance and power handling capabilities of photonic components.

Implementation Method 1

The layer comprises a material that exhibits an electric-field-induced Pockels effect

Methodology Applied

Scientific EffectPockels effect: Pockels Effect

Data Source

PatentUS12455466B2Photonics chip structures including an edge coupler and a layer exhibiting an electric-field-induced Pockels effect

Publication Date: 2025.10.28 GLOBALFOUNDRIES US INC

AI summary

Photonics chip structures including an edge coupler and a layer that exhibits an electric-field-induced Pockels effect and methods of forming such structures. The structure comprises a substrate, an edge coupler on the substrate, and a layer including a portion that has an overlapping relationship with the edge coupler. The layer comprises a material that exhibits an electric-field-induced Pockels effect.