Edge-Adjusted Drop Patterns for Nanoimprint Lithography Defects
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Solution Overview
Problem
In semiconductor fabrication using nanoimprint lithography, there is a challenge with extrusions and non-filled marks near the edges of imprint fields, which affect the accuracy and quality of drop patterns.
Innovation Solution
A system generates edge-adjusted drop patterns by estimating the segment required compensation volume (RCV) of edge segments and using guide commands to create optimal drop arrangements, ensuring accurate deposition of fluid resist onto wafers, thereby reducing defects like extrusions and non-filled marks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a standard drop pattern is used for nanoimprint lithography, then the fabrication process can be completed, but extrusions and non-filled marks occur near the edges of imprint fields
Solution Approach 1:
The patent applies local quality by differentiating edge segments from interior segments and applying different drop arrangement strategies to each. Edge segments receive specialized treatment including compensation volume calculations and adjusted drop patterns, while interior segments use standard patterns. This localized approach resolves the contradiction by improving edge region quality without compromising overall manufacturing efficiency.
Solution Approach 2:
The patent segments the imprint field into edge segments and interior segments based on their proximity to field boundaries. This segmentation allows independent optimization of drop patterns for edge regions, enabling precise control over edge defect formation while maintaining standard processes for interior regions, thereby resolving the contradiction between overall process efficiency and edge quality.
2Manufacturing precision
If edge compensation is implemented to reduce edge defects, then manufacturing precision improves, but the complexity of drop pattern generation increases
Solution Approach 1:
The patent implements preliminary action by pre-calculating compensation volumes for edge segments before generating the final drop pattern. The system computes required compensation volumes based on segment geometry and material properties, then incorporates these calculations into the drop pattern generation process. This advance preparation reduces real-time computational complexity while maintaining high manufacturing precision.
Solution Approach 2:
The patent applies dynamics by making the drop pattern generation process adaptive and adjustable. The system dynamically adjusts drop arrangements based on calculated compensation volumes and user-specified parameters, allowing flexible optimization of edge regions without rigidly fixing the entire process. This dynamic approach balances precision requirements with operational simplicity.
Data Source
AI summary
A base drop pattern (BDP) is generated based on at least one of input parameters. A segment required compensation volume (RCV) of edge segments near edges of the imprint field is estimated. Edge drop arrangements at the edge segments are generated based on the estimated segment RCV and a guide command from a user.