Edge-Edge Stitches for Double Patterning Decomposition
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Solution Overview
Problem
Double patterning techniques in integrated circuit fabrication face limitations in decomposing target pattern layouts with odd cycles, leading to routing congestion due to the requirement for significant space in back-to-back metal routes, which are not compatible with existing double patterning technology.
Innovation Solution
The implementation of edge-edge stitches with routing lines wider than the minimum critical dimension, such as 40 nm or greater, to couple border pins, allowing for more decomposability and reduced routing congestion by requiring less overall space and overlap compared to end-end stitches.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If back-to-back metal routes with minimum critical dimension are used to couple adjacent cells, then routing connectivity is achieved, but routing congestion occurs due to insufficient space and incompatibility with double patterning technology
Solution Approach 1:
The patent changes the width parameter of the B2B metal route line from the minimum critical dimension to a larger dimension (e.g., 40 nm or greater). This parameter change makes the routing compatible with double patterning technology while providing sufficient space to eliminate routing congestion, thereby resolving the contradiction between routing connectivity and routing congestion.
2Ease of manufacture
If metal stitching is applied to remove odd cycles in target patterns, then decomposability of metal layout is maintained, but significant space is required for B2B routes that is incompatible with double patterning technology
Solution Approach 1:
The patent changes the width parameter of the B2B metal route line from the minimum critical dimension to a larger dimension (e.g., 40 nm or greater). This parameter change reduces the number of stitches needed and eliminates odd cycles, thereby maintaining decomposability while reducing the total area occupied by B2B routes, making them compatible with double patterning technology.
3Ease of operation
If typical design rules for spacing and end-end stitches are used for B2B routes, then routing connectivity is achieved, but decomposability of target pattern layouts is limited
Solution Approach 1:
The patent changes the width parameter of the B2B metal route line from the minimum critical dimension to a larger dimension (e.g., 40 nm or greater). This parameter change eliminates odd cycles in the routing layout, thereby maintaining decomposability into two or more complementary patterns while still achieving routing connectivity between adjacent cells.
Data Source
AI summary
Integrated circuits and methods for fabricating integrated circuits are provided. One method includes creating a master pattern layout including first and second adjacent cells. The first adjacent cell has a first border pin with a first routing line. The second adjacent cell has a second border pin with a second routing line. The first and second routing lines overlap to define an edge-edge stitch to couple the first and second border pins. The master pattern layout is decomposed into sub-patterns.