Edge-Enabled Void Isolator for Antenna Isolation
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Solution Overview
Problem
In compact wireless devices, the close proximity of multiple antennas due to limited space hinders effective electromagnetic wave radiation, as conventional isolation methods fail to provide sufficient spatial separation, resulting in insufficient isolation and loss of diversity and directional communication benefits.
Innovation Solution
The implementation of an edge-enabled void isolator (EEVI) between antennas, utilizing a conductive plane with a geometric perimeter and tunable capacitance/inductance to create isolation, allowing antennas to be placed in close proximity while maintaining desired radiation patterns and diversity benefits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional isolation methods are used, then spatial separation between antennas is achieved, but the footprint of the antenna system increases
Solution Approach 1:
The patent introduces an edge-enabled void isolator (EEVI) as an intermediary structure between antennas. The EEVI utilizes the device chassis edge as a reference plane and creates isolation through controlled capacitance and inductance structures, enabling sufficient antenna isolation without requiring large spatial separation, thus reducing the overall antenna system footprint
Solution Approach 2:
The patent transitions from traditional planar isolation methods to a three-dimensional approach by utilizing the vertical dimension and the device chassis edge. The EEVI structure extends from the circuit board toward the chassis edge, creating isolation in the third dimension rather than relying solely on horizontal spacing, which reduces the footprint area
2Area of stationary object
If antennas are placed in close proximity, then the footprint of the wireless device is reduced, but isolation between antennas becomes insufficient
Solution Approach 1:
The EEVI acts as a mediator structure between closely spaced antennas, providing electromagnetic isolation through its capacitive and inductive elements. This allows antennas to be positioned close together for compact device footprint while maintaining sufficient isolation through the intermediary EEVI structure
Solution Approach 2:
The patent employs tunable capacitance and inductance parameters within the EEVI structure to optimize isolation performance. By adjusting these electrical parameters, the EEVI can provide adequate isolation between closely spaced antennas, enabling compact form factor without sacrificing isolation reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The EEVI provides enhanced isolation between antennas, enabling effective radiation and maintaining the compact form factor of wireless devices, thereby achieving improved directional communication and diversity benefits.
Implementation Method 1
The conductive plane includes a first portion forming a first capacitance to ground and a second portion forming a second capacitance to ground
Implementation Method 2
The conductive plane includes a first portion forming a first inductance to ground and a second portion forming a second inductance to ground
Implementation Method 3
an antenna typically requires sufficient spatial separation from other active/passive components in the wireless device so as to radiate effectively an electromagnetic wave(s)
Data Source
AI summary
An edge enabled void isolator (EEVI) for antennas is provided. In particular, two or more antennas are separated from one another by respective EEVI to provide isolation between the antennas. This isolation allows the antennas to be placed in close proximity, keeping the footprint of the antenna system relatively small for ease of use in small wireless devices. While two monopole antennas are specifically contemplated, the disclosure may be extended to more than two antennas and these antennas may be monopole, dipole, F, or the like.