Edge Grip Device Buffering Member for Semiconductor Wafer Handling
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Solution Overview
Problem
Existing edge grip devices for semiconductor wafers experience instability in gripping force due to damping characteristics of shock protection springs, leading to prolonged gripping times and potential damage during handling.
Innovation Solution
An edge grip device with a pressing mechanism featuring a pusher supported by a movable pusher supporting body and a low-bounce, elastically deformable buffering member, which reduces shock and allows for quick movement of the wafer without waiting for damping to subside, enhancing production rates and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shock protection spring is used to reduce shock when the moving pusher contacts the substrate, then shock is reduced, but damping characteristic occurs causing unstable pressing-force and prolonged gripping time
Solution Approach 1:
The patent changes the material parameter of the buffering member from a high-damping spring material to a low-damping elastomeric material. This parameter change allows the buffering member to reduce shock through elastic deformation while minimizing damping characteristics, thereby maintaining stable pressing-force and reducing gripping time.
Solution Approach 2:
The patent uses an elastomeric buffering member that combines the shock-absorbing properties of elastic materials with low damping characteristics. This composite material approach allows simultaneous achievement of shock reduction and rapid response without the prolonged damping period associated with traditional springs.
2Object-affected harmful factors
If a shock protection spring is used to reduce shock, then shock is reduced, but the pressing-force becomes unstable due to damping
Solution Approach 1:
The patent changes the material parameter of the buffering member from a high-damping spring material to a low-damping elastomeric material. This parameter change allows the buffering member to reduce shock through elastic deformation while minimizing damping characteristics, thereby maintaining stable pressing-force and reducing gripping time.
3Object-affected harmful factors
If a traditional spring buffering member is used, then shock is reduced, but the mechanism requires more time for damping to subside before movement
Solution Approach 1:
The patent changes the material parameter of the buffering member from a high-damping spring material to a low-damping elastomeric material. This parameter change allows the buffering member to reduce shock through elastic deformation while minimizing damping characteristics, thereby maintaining stable pressing-force and reducing gripping time.
Solution Approach 2:
The patent eliminates the need to wait for damping to subside by using a low-damping elastomeric buffering member. This allows the system to skip the prolonged damping period and proceed directly to substrate movement, thereby increasing production rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cushions shock, stabilizes the gripping force, and enables quicker handling of semiconductor wafers, improving production efficiency and preventing damage, while maintaining a compact mechanism design.
Implementation Method 1
the buffering member having a low bounce and being elastically deformable, wherein, when the pusher supporting body moves in the pressing direction, the pusher supporting body pushes the pusher through the buffering member
Data Source
AI summary
A chuck hand 1 includes a pressing mechanism 14 having a pusher 25 which presses a semiconductor process wafer 3 in the direction of a front guide 12 to thereby grip the semiconductor process wafer 3. The pressing mechanism 14 further has a pusher supporting body 22 and a buffering member 28. The pusher supporting body 22 is configured such that it can advance and retract. The pusher supporting body 22 is disposed in the pusher 25 such that it can slide back and forth. A gap 26a is defined forward relative to the pusher supporting body 22. The buffering member 28, which has a low bounce and is elastically deformable, is interposingly placed in the gap 26a. When the pusher supporting body 22 moves forward, it pushes the pusher 25 through the buffering member 28 whereby the pusher 25 is moved forward. The pusher 25 is abutted and pressed against the semiconductor process wafer 3.