Edge Grip Wafer Handler Tilt Mechanism
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Solution Overview
Problem
Existing semiconductor wafer handling systems face challenges in preventing undesired contact between wafers and handling devices due to wafer bow and end effector deformations, which can render the systems non-functional.
Innovation Solution
The solution involves an edge grip end effector with adjustable wafer supports that tilt the wafer to maintain a safe distance from the end effector, using sensors to measure and adjust the distance, and incorporating an active cushion mechanism to prevent contact, ensuring reliable and damage-free handling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If rigid support structures are used to hold the wafer, then structural stability is improved, but contact between the wafer and end effector body occurs due to bow and deformation
Solution Approach 1:
The support structure is divided into multiple independent support pads distributed across the end effector body. Each pad can independently support the wafer at specific locations, allowing the structure to remain stable while preventing contact between the wafer and the end effector body through proper geometric distribution and clearance design.
Solution Approach 2:
Multiple support pads act as intermediaries between the end effector body and the wafer. These pads provide the necessary support function while maintaining physical separation, preventing direct contact between the wafer and the end effector body even when bow or deformation occurs.
2Length of stationary object
If the end effector is designed with minimal height to fit in cassette pitch, then space utilization is improved, but clearance between wafer and end effector body is reduced increasing contact risk
Solution Approach 1:
The support function is transitioned from a continuous surface to discrete point contacts through multiple support pads. This dimensional change allows the end effector to maintain minimal height for cassette compatibility while the distributed pad configuration creates adequate clearance zones that prevent wafer contact with the end effector body.
3Object-affected harmful factors
If wafer support distance is increased to prevent contact, then contact prevention is improved, but wafer support stability during acceleration and deceleration deteriorates
Solution Approach 1:
Different regions of the end effector have different functions: support pads provide localized support points close to the wafer for stability during dynamic operations, while the geometric distribution and clearance design of these pads ensure that the wafer maintains adequate distance from the end effector body to prevent contact during acceleration and deceleration.
Data Source
AI summary
A mechanism for handling substrates such as semiconductor wafers is disclosed. The mechanism supports the substrate in a tilted orientation to ensure that undesirable contact between a bowed substrate and the mechanism does not occur. The structure that supports the substrate in a tilted orientation may be fixed or adjustable. A sensor may be provided to measure and/or monitor a distance between a substrate and the mechanism. Alternatively, a sensor for determining contact between the substrate and the mechanism may be provided.