Circuit Carrier Assembly With Edge Heat Sink for Compact Chip Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power electronics assemblies face challenges in effectively dissipating heat while minimizing installation space, as the heat dissipation direction is perpendicular to the layer plane, requiring a large surface area for the heat sink and additional space for connections, which is not feasible in applications with limited space.
Innovation Solution
The electronics assembly features a planar design with a heat dissipation path running parallel to the principal plane, utilizing thick-film conductor tracks thermally coupled to a heat sink located in an edge region, allowing for effective heat transfer and dissipation without the need for extensive surface area exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional horizontal structure with heat dissipation perpendicular to the layer plane is used, then effective heat transfer is achieved, but a large installation space is required
Solution Approach 1:
The patent changes the heat dissipation direction from perpendicular to the layer plane (conventional horizontal structure) to parallel with the layer plane (vertical structure). This dimensional change allows the heat sink to be positioned at the edge of the circuit carrier, transforming the heat dissipation path from a vertical configuration requiring large surface area to a horizontal configuration that minimizes installation footprint while maintaining effective heat transfer through the thick-film conductor track
2Temperature
If the heat sink is positioned to be accessible on its entire outer surface for cooling air flow, then heat dissipation is effective, but additional installation space is needed for connections and control lines
Solution Approach 1:
The patent merges the heat sink with the edge region of the circuit carrier, integrating the cooling function directly into the structural boundary of the assembly. This integration eliminates the need for separate connection spaces and control line routing that would be required in conventional horizontal structures, as the heat dissipation function is combined with the edge geometry of the compact vertical assembly
3Power
If power density is increased to improve performance, then power output is improved, but heat dissipation becomes more difficult in limited space
Solution Approach 1:
The patent changes the geometric parameters of the heat dissipation path by implementing a vertical structure with thick-film conductor tracks having substantial thickness (at least 300 μm). This parameter change in the heat conduction path geometry, combined with the edge-positioned heat sink, enables effective heat dissipation from high power density semiconductor chips without requiring large installation space, thus resolving the contradiction between power density improvement and heat dissipation difficulty
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables compact installation of power electronics assemblies with efficient heat dissipation, reducing the overall space requirement while maintaining high performance by directing the heat dissipation path within the assembly plane, thus minimizing the installation space needed.
Implementation Method 1
the at least one thick-film conductor track (11, 13, 16), which is part of a principal heat dissipation path (H), between the region of the at least one semiconductor chip (20a, 20b) and the first edge region (R1), wherein the at least one thick-film conductor track (11, 13, 16) is coupled thermally to the heat sink (30)
Implementation Method 2
The heat sink must thus be accessible to the external environment on its entire outer surface, in order for example to have a flow of cooling air flowing over it
Implementation Method 3
a flow of cooling air flowing over it
Data Source
AI summary
Various embodiments of the teachings herein include an electronics assembly comprising: a circuit carrier; a semiconductor chip mounted on the circuit carrier; and a heat sink. The circuit carrier and the semiconductor chip each have a planar basic shape extending along parallel principal planes. The heat sink is arranged in a first edge region of the parallel principle planes. The circuit carrier includes a thick-film conductor track defining a principal heat dissipation path between a first edge region of the semiconductor chip and the first edge region of the circuit carrier. The thick-film conductor track is thermally coupled to the heat sink and has a layer thickness of at least 300 μm. The principal heat dissipation path runs parallel to the principal plane of the semiconductor chip to the heat sink in the first edge region. The semiconductor chip is bonded both electrically and also thermally to the conductor track.