Edge Ring and Heating Ring Layout for Plasma Uniformity
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Solution Overview
Problem
In semiconductor device manufacturing, achieving uniform plasma distribution and preventing by-product deposition in substrate processing is challenging due to temperature variations and mechanical instability, leading to process defects and reduced device lifespan.
Innovation Solution
A substrate processing device is designed with a heating ring, cooling ring, and edge ring configuration, including thermal insulation rings and silicon pads, to manage temperature gradients and distribute plasma uniformly, while the edge ring covers the top surfaces of the heating and cooling rings to direct by-products away from critical areas, enhancing durability and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a heating ring is used to concentrate plasma in the upper portion of the substrate, then plasma distribution uniformity is improved, but temperature variations cause by-product deposition and reduce component lifespan
Solution Approach 1:
The patent applies parameter changes by implementing independent temperature control for different zones. The heating ring is divided into multiple heating zones with separately controllable heating powers, allowing the central region and edge region to be heated to different temperatures. This resolves the contradiction by maintaining optimal plasma distribution while preventing by-product deposition through localized temperature management.
Solution Approach 2:
The patent implements local quality by creating distinct thermal zones within the heating ring. Different regions (central vs. edge) are heated to different temperatures based on their specific requirements. The edge region is heated to a temperature lower than the central region to prevent by-product deposition, while the central region maintains higher temperature for optimal plasma generation. This localized differential heating resolves the contradiction between plasma uniformity and component reliability.
2Use of energy by moving object
If thermal insulation measures are implemented to maintain heating efficiency, then energy utilization is improved, but by-product deposition increases on heated surfaces
Solution Approach 1:
The patent applies local quality by implementing differential heating zones where the edge region is heated to a lower temperature than the central region. The edge heating zone is specifically controlled to prevent by-product deposition while maintaining sufficient heat for process stability. This localized temperature control resolves the contradiction by reducing harmful deposits in critical areas while preserving overall heating efficiency.
Solution Approach 2:
The heating ring is segmented into multiple independently controllable heating zones. This segmentation allows the edge zone to be heated at a lower temperature to prevent by-product deposition, while the central zone maintains higher temperature for efficient plasma generation. The segmented structure resolves the contradiction by enabling localized thermal management that prevents harmful deposits without sacrificing overall energy efficiency.
3Quantity of substance
If the edge ring is heated to high temperature to improve plasma generation, then plasma density increases, but mechanical stability of the device structure deteriorates
Solution Approach 1:
The patent implements local quality by creating different thermal environments for different structural components. The edge ring is heated to a lower temperature than the central region, maintaining sufficient plasma generation while preserving the mechanical stability of the edge ring structure. This localized differential heating resolves the contradiction between plasma density and structural stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration improves the uniformity of plasma distribution, reduces by-product deposition, extends the lifespan of processing components, and enhances the mechanical stability and reliability of the substrate processing device.
Implementation Method 1
a heating electrode arranged to be vertically adjacent to the edge ring
Implementation Method 2
The cooling ring may include a cooling channel through which a cooling fluid circulates
Implementation Method 3
a thermal insulation ring arranged between the substrate supporter and the heating ring and horizontally surrounding the substrate supporter
Implementation Method 4
a support puck configured to support a substrate on a top surface thereof by generating an electrostatic tensile force
Data Source
AI summary
A substrate processing device is provided. The substrate processing device includes: a substrate supporter configured to support a substrate; a heating ring horizontally surrounding the substrate supporter; and an edge ring horizontally surrounding the heating ring and configured to cover a top surface of the heating ring.