Edge Incident Light Receiving Device With Reflection Section
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Edge incident type semiconductor light receiving devices are limited in their applicability due to light attenuation when the semiconductor substrate absorbs incident light of shorter wavelengths, making them ineffective for optical communication systems that utilize such wavelengths.
Innovation Solution
The device incorporates a light guide section and a reflection section with a predetermined intersection angle to redirect incident light around the opaque semiconductor substrate, ensuring that light is not absorbed and is instead reflected to the light receiving section, thereby reducing attenuation and enabling the use of wavelengths absorbed by the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If light travels through the semiconductor substrate to reach the light receiving section, then the device structure is simple, but light of wavelengths absorbed by the substrate is attenuated and cannot reach the light receiving section
Solution Approach 1:
The light guide section changes the light propagation path from a direct through-substrate route to a lateral route along the substrate surface. By exposing the light receiving section through the light guide section and using a reflection section at a predetermined angle, light travels along the main surface rather than through the bulk substrate, avoiding absorption by opaque materials while maintaining structural simplicity.
Solution Approach 2:
The light guide section acts as an intermediary structure that mediates between the incident light and the light receiving section. It provides a dedicated light transmission pathway that bypasses the absorbing substrate regions, allowing light to reach the photodetector without being absorbed, thus solving the contradiction between structural simplicity and light transmission efficiency.
2Object-affected harmful factors
If the semiconductor substrate is made opaque to block certain wavelengths, then substrate absorption increases, but light cannot reach the light receiving section
Solution Approach 1:
By changing the light propagation dimension from vertical (through substrate) to lateral (along surface), the invention allows the substrate to be opaque to certain wavelengths without preventing light reception. The light guide section creates a surface-level transmission path that bypasses the absorbing substrate regions, maintaining reliability for both transparent and opaque substrate configurations.
Solution Approach 2:
The light guide section creates a localized region with different optical properties along the light path. By exposing the light receiving section through this specially designed light guide structure, the patent ensures that light travels through regions where substrate absorption is minimal or nonexistent, allowing the bulk substrate to be opaque while maintaining local light transmission capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows the edge incident type semiconductor light receiving device to effectively capture incident light across a broader spectrum, including wavelengths absorbed by the semiconductor substrate, enhancing its applicability and sensitivity.
Implementation Method 1
a reflection section having a predetermined intersection angle with the main surface is provided at an end section of the light guide section in the light incident direction
Data Source
AI summary
In an edge incident type semiconductor light receiving device that reflects light incident parallel to the main surface of the semiconductor substrate opaque to the incident light to the light receiving section on the main surface side, a light guide section is formed to expose the light receiving section along the light incident direction from the light incident side end of the semiconductor substrate, and in order to guide the light incident on the light guide section to the light receiving section, a light reflection section having a given crossing angle with the main surface is provided at the end of the light guide section in the light incident direction.