Edge-Emitting Laser Package With Reflected APC Feedback
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Solution Overview
Problem
Existing semiconductor light-emitting devices face challenges in increasing the output of the light source and maintaining consistent laser beam output despite temperature variations, particularly when using edge-emitting chips like edge-emitting lasers.
Innovation Solution
The semiconductor light-emitting device incorporates a light-receiving chip with a light-receiving element that receives part of the laser beam from an edge-emitting chip, utilizing an auto power control drive to adjust current supply based on the received light, and includes a reflector or reflection layer in the encapsulant to direct laser beams towards the light-receiving element, ensuring consistent output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the output of the light source is increased, then the brightness and effectiveness of the semiconductor light-emitting device is improved, but the consistency of laser beam output under temperature variations deteriorates
Solution Approach 1:
The patent implements a feedback control mechanism where a light-receiving element detects the actual light output from the light-emitting element, and this detection signal is fed back to a drive circuit that adjusts the drive current accordingly. This closed-loop feedback system maintains consistent laser beam output despite temperature variations by continuously monitoring and correcting the light output based on the detected signal, thereby resolving the contradiction between increased output and output consistency.
2Productivity
If a separate reflector is added to direct laser beams, then the light reception efficiency is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the reflector function with the encapsulant by forming a reflection layer directly on the inner surface of the encapsulant. This integration eliminates the need for a separate reflector component, reducing device complexity and manufacturing steps while maintaining the light-directing function. The encapsulant serves dual purposes: protecting the internal components and reflecting light towards the light-receiving element, thereby improving light reception efficiency without increasing structural complexity.
Solution Approach 2:
The encapsulant is designed to perform multiple functions simultaneously: it acts as a protective enclosure for the internal components and as a reflector to direct laser beams towards the light-receiving element. By giving the encapsulant this multi-functional role, the patent eliminates the need for a dedicated reflector component, simplifying the overall device structure while maintaining effective light reception.
3Adaptability or versatility
If multiple separate components are used, then the functionality is improved, but the manufacturing process and cost increase
Solution Approach 1:
The patent combines multiple functional components into integrated structures: the reflector is merged with the encapsulant by forming a reflection layer on its inner surface, and the light-receiving element is integrated directly with the encapsulant structure. These merging operations reduce the total number of discrete components, simplify the manufacturing process by reducing assembly steps, and lower overall production costs while preserving all necessary device functionalities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure allows for consistent laser beam output regulation and reduces manufacturing complexity and costs by integrating the reflector within the encapsulant, enhancing the device's performance and reliability.
Implementation Method 1
a light-receiving chip (30) arranged on the substrate (20) and including a light-receiving element (38)
Implementation Method 2
a reflector (70) included in the encapsulant (50) and configured to reflect at least part of the second laser beam towards the light-receiving surface (38A)
Data Source
AI summary
The semiconductor light-emitting device includes: a substrate; a light-receiving chip that includes a light-receiving element having a light-receiving surface formed on the chip surface; an edge-emitting chip that has a first light-emitting surface that emits first laser beam and a second light-emitting surface that emits second laser beam in an opposite direction, and that is joined to a position different from the light-receiving surface on the chip surface; a sealing member with a material through which the first and second laser beams can pass, the sealing member covering the edge-emitting chip and the light-receiving chip; and a reflection part provided in the sealing member and that reflects at least a portion of the second laser beam toward the light-receiving surface. The light-receiving surface is formed in a position on the chip surface for receiving at least a part of the reflected light by the reflection part.