Edge Metal Layers for Ceramic Substrate Warpage Control
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Solution Overview
Problem
Metal-bonded ceramic substrates tend to warp due to differences in metal patterns on top and bottom surfaces and thermal expansion coefficients, making them difficult to handle and prone to breakage in mass production.
Innovation Solution
Forming an additional metal layer along the edges of the substrate with controlled mass distribution on top and bottom surfaces to counteract warpage, with the additional metal layer being strategically placed and shaped to balance mass differences and reduce warping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the substrate size is increased to manufacture complex arranged substrates for mass production, then productivity is improved, but warpage increases making handling and fixation difficult
Solution Approach 1:
The patent applies local quality by forming additional metal layers at specific locations (edges and corners) of the substrate rather than uniformly across the entire surface. This localized addition of metal layers counteracts the warpage caused by the large substrate size while maintaining productivity benefits of complex arranged substrates.
Solution Approach 2:
The patent uses the additional metal layers as counterweights to balance the warpage forces. By strategically placing metal layers with controlled masses at edges and corners, the system creates counteracting forces that prevent the substrate from warping, enabling handling of large-sized substrates in mass production.
2Stability of the object's composition
If additional metal layers are added to prevent warpage, then warpage is reduced, but the complexity of the manufacturing process increases
Solution Approach 1:
The patent segments the additional metal layers into distinct components: corner metal layers and edge metal layers. This segmentation allows for simplified manufacturing by treating each segment separately with controlled masses, reducing the overall complexity compared to attempting to uniformly distribute metal across the entire substrate.
Solution Approach 2:
The patent applies partial action by adding metal layers only where needed (at edges and corners) rather than uniformly across the entire substrate. This selective approach reduces the total amount of metal processing required while still achieving effective warpage prevention, thereby reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces warpage of metal-bonded ceramic substrates by up to 88% and prevents fractures, allowing for more stable handling and processing in automation and semiconductor mounting processes.
Implementation Method 1
the warpage which results from the difference in the thermal expansion coefficients of a metal pattern and the substrate
Data Source
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AI summary
The present invention relates to a warpage-preventing structure for reducing the warpage of the substrate itself, the warpage which results from the difference of the metal patterns of top and bottom surfaces, and/or the warpage which results from the difference in the thermal expansion coefficients of a metal pattern and the substrate, the warpage-preventing structure comprising at least one additional metal layer, wherein the at least one additional metal layer is disposed on at least one surface of the substrate and arranged along an edge of the substrate.