Edge Mount Semiconductor Package With Folded Flex Substrate
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Solution Overview
Problem
Existing semiconductor package stacking solutions result in increased electrical path lengths, higher test yield loss, and excessive area/thickness, making them unsuitable for miniaturized portable devices, where space is limited and precious.
Innovation Solution
A semiconductor package with a flexible substrate formed from flex tape, allowing for edge mounting in a vertical orientation, featuring a conductive pattern on one surface and conductive pads on the other, which are folded to extend perpendicularly, enabling efficient use of space and reducing electrical path lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If semiconductor packages are stacked on top of each other to increase mounting density, then the number of packages per area increases, but the electrical path length increases and electrical performance deteriorates
Solution Approach 1:
The patent transitions from conventional planar mounting to vertical edge mounting by changing the mounting dimension. The flexible substrate is folded to extend perpendicular to the PCB surface, allowing packages to be mounted on the edge rather than the surface area, thus reducing electrical path length while maintaining high mounting density through vertical stacking capability
Solution Approach 2:
The patent uses a flexible substrate (flex tape) that can be folded and bent to achieve the vertical mounting configuration. This flexible film allows the conductive terminals to be positioned at the edge of the package body, enabling short electrical paths while maintaining the compact form factor needed for high-density mounting
2Quantity of substance
If multiple devices are integrated into a vertical stack within a single package to maximize space utilization, then mounting density increases, but test yield loss increases
Solution Approach 1:
The patent divides the system into separate packages, each containing a subset of devices, rather than integrating all devices into a single complex stack. This segmentation allows each package to be tested and validated independently, reducing test yield loss while still achieving high overall mounting density through the vertical edge mounting configuration
3Area of stationary object
If conventional stacking solutions are used to minimize PCB area, then area utilization improves, but package thickness increases excessively
Solution Approach 1:
The patent changes the mounting orientation from horizontal (increasing area usage) to vertical edge mounting (utilizing the edge perimeter). This dimensional change allows high-density mounting without excessive thickness increase, as the flexible substrate is folded to extend perpendicular to the PCB surface rather than stacking horizontally
Data Source
AI summary
A semiconductor package which is structured to allow for the edge mounting thereof in a vertical mount orientation. The semiconductor package comprises a flexible substrate or “flex circuit.” The flexible substrate includes a conductive pattern disposed on a first surface thereof, and a plurality of conductive pads or terminals disposed on a second surface thereof which is disposed in opposed relation to the first surface. Mounted to the first surface of the flexible substrate are one or more electronic components such as semiconductor dies. The semiconductor die(s) is/are electrically connected to the conductive pattern, and thereafter covered or encapsulated by a package body applied to a portion of the first surface of the flexible substrate. That portion of the flexible substrate including the conductive pads or terminals formed on the second surface thereof is thereafter folded and adhered to a portion of the package body through the use of a suitable adhesive.