Edge-Mountable Semiconductor Chip Package for Perpendicular Sensor Orientation
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Solution Overview
Problem
Existing semiconductor chip packaging technologies limit the orientation and effectiveness of sensor systems by restricting the mounting of semiconductor chips to conventional surface-mountable configurations, which can hinder the optimal operation of sensors that require perpendicular emission or detection paths.
Innovation Solution
An edge-mountable semiconductor chip package is developed, allowing the semiconductor chip to be oriented perpendicular to the substrate, with electrodes exposed on the edges and a filler material like epoxy molded between the chip and electrodes, enabling redistribution layers to connect conductors to these electrodes for secure mounting and efficient electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional surface-mountable packaging is used, then the mounting process is simple, but the sensor orientation is limited and cannot achieve perpendicular emission or detection paths
Solution Approach 1:
The patent transitions from conventional surface-mounted packaging to edge-mounted packaging, changing the mounting dimension from planar to vertical. The semiconductor chip is mounted on the edge of the substrate rather than the surface, enabling perpendicular emission or detection paths while maintaining electrical connection through edge-exposed electrodes.
Solution Approach 2:
The patent introduces a filler material as an intermediary substance that is molded between the semiconductor chip and the substrate edge. This filler material secures the chip in the perpendicular orientation and provides mechanical support, enabling the complex edge-mounting configuration.
2Reliability
If edge-mountable packaging is used, then perpendicular emission or detection paths are achieved, but the packaging structure becomes more complex with exposed electrodes and molded filler
Solution Approach 1:
The patent achieves perpendicular emission or detection paths by mounting the semiconductor chip on the edge of the substrate rather than the surface. This dimensional change allows the sensor to operate effectively in applications requiring vertical light paths, improving reliability for specific sensor types.
Solution Approach 2:
The patent combines multiple functions into the filler material: mechanical support for the perpendicular-mounted chip, electrical insulation for the exposed electrodes, and structural bonding between the chip and substrate. This integration reduces the need for additional separate components.
3Ease of operation
If surface-mountable configuration is used, then the layout is conventional, but the sensor system layout and operation are hindered
Solution Approach 1:
The patent changes the mounting configuration from surface-mounted to edge-mounted, enabling perpendicular sensor orientation. This allows the sensor system layout to accommodate vertical emission or detection paths, improving effectiveness in applications such as air quality monitoring where direct vertical sensing is required.
Data Source
AI summary
A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.