Edge-Mounted Magnetic Sensor Chip for Compact PCB Integration
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Solution Overview
Problem
Existing magnetic field sensors face challenges in miniaturization while maintaining high measurement accuracy, particularly in consumer products where small dimensions and precise detection are required.
Innovation Solution
The development of a sensor device featuring a magnetic field sensor chip with a sensor element on its front face and contact pads arranged at the edge, allowing for efficient mounting on a printed circuit board without the need for additional chip housing or magnetic flux concentrators.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If magnetic field sensors are miniaturized for consumer products, then the size is reduced, but measurement accuracy deteriorates
Solution Approach 1:
The patent transitions from in-plane magnetic field detection to out-of-plane detection by orienting the sensor element's sensitive axis perpendicular to the chip's front face. This dimensional change allows the sensor to detect magnetic field components along the z-axis (perpendicular to the chip surface) rather than only in the plane of the chip, enabling compact design without sacrificing detection capability for vertical magnetic field components
Solution Approach 2:
The patent inverts the conventional sensor orientation by mounting the chip with its front face perpendicular to the printed circuit board (edge-up orientation) rather than the conventional flat mounting. This inversion allows the out-of-plane sensor element to detect magnetic fields perpendicular to the front face, which translates to detecting fields perpendicular to the PCB surface, achieving compact form factor while maintaining measurement accuracy
2Measurement precision
If out-of-plane magnetic field sensors are used for high accuracy detection, then measurement accuracy is improved, but device dimensions increase
Solution Approach 1:
The patent combines multiple functions into a single integrated chip structure: the sensor element, contact pads, and mounting interface are all integrated into one compact chip. The contact pads are positioned at the edge of the chip to enable direct electrical connection when mounted edge-up on the PCB, eliminating the need for separate connection structures or additional components, thus achieving high accuracy out-of-plane detection in a compact form factor
Solution Approach 2:
By utilizing the z-axis (perpendicular to the chip front face) for magnetic field detection, the patent enables out-of-plane sensing without requiring additional lateral space. The sensor element's sensitive axis is oriented along the z-direction, allowing detection of vertical magnetic field components while maintaining a compact footprint on the PCB
3Ease of manufacture
If contact pads are arranged on the front face for electrical connection, then ease of manufacture is improved, but mounting complexity increases when edge-up orientation is used
Solution Approach 1:
The patent inverts the conventional contact pad arrangement by positioning all contact pads at the edge of the chip on the front face, rather than distributing them across the center or rear face. This edge-oriented arrangement aligns perfectly with the edge-up mounting orientation, allowing direct electrical connection to PCB traces when the chip is mounted with its front face perpendicular to the board, thereby simplifying both manufacturing and mounting processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of compact magnetic field sensors with high accuracy, suitable for use in consumer products such as cell phones, without the increased dimensions typically associated with out-of-plane magnetic field sensors.
Implementation Method 1
a sensor element which is arranged on the front face and is configured to detect a magnetic field component running parallel to the front face
Data Source
AI summary
A sensor device contains a magnetic field sensor chip having a front face, a rear face and a side surface connecting the front face and the rear face. The magnetic field sensor chip has a sensor element which is arranged on the front face and is configured to detect a magnetic field component running parallel to the front face. The magnetic field sensor chip furthermore has multiple first contact pads arranged on the front face, wherein all of the first contact pads arranged on the front face are arranged at an edge of the magnetic field sensor chip lying between the front face and the side surface.