Edge-Mounted Thermal Jumper for Multi-Layer PCB Cooling
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Solution Overview
Problem
Conventional thermal conduction cooling techniques in electronic assemblies often face high thermal resistance due to single conductive layer paths, which can lead to insufficient heat dissipation and elevated component temperatures, especially when convection cooling is unavailable or insufficient.
Innovation Solution
The use of edge-mounted SMT components thermally coupled to multiple conductive plane layers via attach pads on the substrate's edge surface, providing a reduced thermal resistance pathway for heat dissipation while maintaining electrical isolation between these layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional thermal conduction cooling techniques use single conductive layer paths, then the structure is simple, but thermal resistance is high and heat dissipation is insufficient
Solution Approach 1:
The patent segments the thermal conduction path by introducing multiple conductive layers (first conductive layer, second conductive layer, third conductive layer) instead of using a single conductive path. Each layer is positioned at different heights and connected through vertical conductive structures, creating a multi-segmented thermal management architecture that reduces thermal resistance while distributing heat across multiple pathways.
Solution Approach 2:
The patent transitions from a single-plane thermal conduction approach to a three-dimensional multi-layer structure. Conductive layers are stacked vertically at different heights, connected through vertical conductive structures, transforming the thermal management system from two-dimensional to three-dimensional space utilization, thereby increasing heat dissipation capacity without proportionally increasing footprint area.
2Temperature
If multiple conductive plane layers are used for thermal conduction, then thermal resistance is reduced, but electrical isolation between layers becomes challenging
Solution Approach 1:
The patent introduces dielectric layers as intermediary materials positioned between adjacent conductive layers. These dielectric layers serve as electrical insulators while allowing thermal conduction, effectively mediating between the need for electrical isolation and thermal connectivity. The dielectric material creates electrical barriers between conductive planes while maintaining thermal pathways through the multi-layer structure.
3Temperature
If dedicated heat sink layers are added adjacent to power and ground layers, then thermal conduction is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The patent designs conductive layers that serve multiple functions simultaneously: they provide electrical connectivity for power and ground distribution, act as thermal conduction pathways for heat dissipation, and form structural frameworks for mounting components. This multi-functionality eliminates the need for separate dedicated heat sink layers, as the existing conductive infrastructure is optimized to perform both electrical and thermal roles.
Solution Approach 2:
The patent merges the thermal management function with the existing electrical conductor layers by positioning heat-generating components directly on these conductive layers. The power and ground layers, which would otherwise serve only electrical purposes, are simultaneously utilized as thermal conduction pathways, combining electrical and thermal management functions into a unified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances thermal management by reducing thermal resistance and impedance, allowing for more effective heat transfer and maintaining component temperatures within safe operating ranges, even in environments with limited convection cooling.
Implementation Method 1
The thermal jumper may be composed of an electrically insulating material with high thermal conductivity, such as aluminum nitride, beryllium oxide, or diamond. Thermal energy may be conducted between the first and second groups of common conductive plane layers via the edge-mounted component
Data Source
AI summary
An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.