Edge-Protected RDL Interposer Assembly Against Warpage and Delamination

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Solution Overview

Problem

Semiconductor device assemblies with redistribution layer (RDL) interposers face challenges such as susceptibility to warpage and delamination due to inconsistent material expansion and contraction, leading to limited operational capacity and increased risk of contamination and failure.

Innovation Solution

The implementation of edge-protected RDL interposers, where the mold material fully encases the RDL interposer, including its sides, to provide structural support and protect against environmental impurities, allowing for additional layers and enhanced longevity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of stationary object

If RDL interposer is used to reduce assembly height, then assembly height is reduced, but susceptibility to warpage and delamination increases

Engineering Contradiction:
Improveassembly heightVSAvoidwarpage and delamination susceptibility
Core Design Contradiction:
Length of stationary objectVSStability of the object's composition

Solution Approach 1:

The patent applies different material properties to different regions of the RDL interposer structure. Specifically, the interposer uses a core substrate material with certain thermal expansion properties, while the edge protection layer uses a different material composition that provides enhanced mechanical support and different thermal characteristics. This local differentiation of material properties allows the structure to maintain low height while resisting warpage and delamination through the edge-protected regions.

Inventive Principle:
Principle #3Local quality

2Length of stationary object

If RDL interposer is used to reduce assembly height, then assembly height is reduced, but susceptibility to contamination and damage increases

Engineering Contradiction:
Improveassembly heightVSAvoidcontamination and damage susceptibility
Core Design Contradiction:
Length of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent implements edge protection layers that extend beyond the functional boundaries of the RDL interposer before final assembly completion. These protection layers are applied in advance to cover and shield vulnerable edge regions during manufacturing and handling processes. The protection layers act as a first line of defense against environmental impurities and mechanical damage, allowing the compact RDL interposer structure to maintain its height-reducing benefits while gaining enhanced protection.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Productivity

If additional layers are added to RDL interposer to increase operational capacity, then operational capacity increases, but susceptibility to warpage and delamination increases

Engineering Contradiction:
Improveoperational capacityVSAvoidwarpage and delamination susceptibility
Core Design Contradiction:
ProductivityVSStability of the object's composition

Solution Approach 1:

The patent employs a composite material structure for the RDL interposer, combining multiple materials with complementary properties. The core substrate provides mechanical support, while the added functional layers contribute to operational capacity. The edge protection layers use materials specifically selected to provide thermal expansion compensation and mechanical reinforcement. This composite construction allows the interposer to accommodate multiple functional layers for increased operational capacity while the edge-protected composite structure resists warpage and delamination.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS20240113002A1Edge-protected semiconductor device assemblies and associated methods
Publication Date: 2024.04.04 MICRON TECHNOLOGY INC
  • US20240113002A1 patent drawing
  • US20240113002A1 patent drawing
  • US20240113002A1 patent drawing

AI summary

The present technology can include a semiconductor device assembly comprising an RDL with a top surface and a side surface intersecting the top surface. The assembly can further comprise a semiconductor device coupled to the top surfaces, and a mold material encasing the semiconductor device (when included) and directly coupled to at least a portion of the top surface and the side surface of the RDL. In other embodiments, the assembly can comprise an RDL with a top surface, a bottom surface opposite thereto, and a sloped side surface extending between the top surface and the bottom surface. The assembly similarly can further comprise a semiconductor device coupled to the top surface, and a mold material encasing the semiconductor device and directly coupled to at least a portion of the top surface and the side surface of the RDL.