Edge Ring Erosion Monitoring Using Weight-Based Height Control
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Solution Overview
Problem
Existing erosion monitoring techniques for edge rings in wafer fabrication equipment are inaccurate due to non-linear erosion patterns and space constraints, leading to ion sheath bending and yield loss during the manufacturing of memory devices.
Innovation Solution
A real-time edge ring erosion rate measurement technology using sensors to measure the weight of the edge ring, converting it into a ring height, and adjusting its position via actuators to maintain optimal alignment, thereby correcting ion sheath bending and reducing yield loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If existing erosion monitoring techniques are used, then space constraints are accommodated, but measurement precision deteriorates due to non-linear erosion patterns
Solution Approach 1:
The patent replaces complex optical or mechanical measurement systems with a simple weight-based measurement system. By measuring the weight of the edge ring over time, the system directly quantifies erosion without requiring complex space-resolving instrumentation. This mechanical substitution achieves high measurement precision while maintaining simplicity and avoiding space constraints.
2Manufacturing precision
If edge ring position is not adjusted, then device complexity is minimized, but manufacturing precision deteriorates due to ion sheath bending
Solution Approach 1:
The patent implements a feedback control system where weight measurements of the edge ring are continuously monitored, and the measured weight changes are used to calculate and apply position adjustments. This feedback loop ensures the edge ring maintains optimal positioning despite erosion, achieving high manufacturing precision through automated compensation rather than manual intervention.
Solution Approach 2:
The system enables the edge ring to essentially self-correct its position through automated weight-based monitoring and actuator-driven adjustment. The erosion compensation process becomes self-service, where the system automatically detects and corrects its own degradation without external intervention, maintaining precision while minimizing operational complexity.
3Measurement precision
If real-time weight measurement is implemented, then erosion monitoring precision is improved, but device complexity increases due to additional sensors and actuators
Solution Approach 1:
The patent replaces complex real-time erosion measurement systems with simple weight measurements using load cells or similar weight sensors. This mechanical substitution achieves real-time monitoring precision while dramatically reducing system complexity, as weight measurement is inherently simpler than optical or mechanical erosion depth measurement.
Data Source
AI summary
Methods, systems, and apparatuses for erosion rate monitoring for wafer fabrication equipment are described to support determining a real-time edge ring erosion rate for an edge ring used in manufacturing memory devices or other semiconductor devices. A manufacturing system may support a real-time edge ring erosion rate determination using force sensors, which may measure the weight of the edge ring. The controller may correlate the measured weight to a height of the edge ring. The controller may use the height to adjust a vertical placement of the edge ring, or one or more other manufacturing variables, during manufacturing operations, which may compensate for edge ring erosion and reduce or eliminate yield loss when manufacturing a memory device or other semiconductor device.