Edge Ring Flow Holes for Plasma Uniformity
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Solution Overview
Problem
In semiconductor fabrication processes, the edge region of substrates experiences uneven plasma distribution due to airflow changes and gas accumulation, leading to poor process uniformity and potential process failures.
Innovation Solution
A ring assembly with an edge ring and supporting members is designed to enclose the chuck body, featuring flow holes that exhaust process gases, preventing gas accumulation and maintaining airflow stability between the substrate and edge ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an edge ring is added to improve plasma uniformity, then process uniformity is improved, but device complexity increases
Solution Approach 1:
The edge ring is integrated with the chuck body in a nested configuration where the edge ring surrounds and encloses the chuck body. The flange portion of the edge ring fits over the outer circumference of the chuck body, creating a compact nested structure that improves plasma uniformity without requiring separate complex components.
Solution Approach 2:
The edge ring serves multiple functions: it encloses the chuck body to define the processing region, provides structural support through its flange portion, and works with the flow holes to manage gas flow. This multi-functionality reduces the need for additional separate components, thereby improving process uniformity without proportionally increasing device complexity.
2Reliability
If flow holes are added to exhaust process gas, then gas accumulation is reduced, but manufacturing complexity increases
Solution Approach 1:
The edge ring incorporates flow holes that create a porous-like structure for gas exhaust. These holes are strategically positioned in the edge ring body to allow process gas to escape from the gap between the substrate and edge ring, preventing gas accumulation and improving process reliability while maintaining a relatively simple manufacturing approach.
3Manufacturing precision
If the edge ring encloses the chuck body tightly, then plasma distribution is improved, but airflow stability deteriorates
Solution Approach 1:
The flow holes in the edge ring act as intermediary channels that mediate between the enclosed space and the external environment. They allow controlled gas exchange that prevents pressure buildup while maintaining the enclosing structure's integrity, thus preserving both plasma distribution uniformity and airflow stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances substrate processing by reducing gas accumulation and process failures, ensuring improved uniformity and efficiency in plasma-based processes like etching and deposition.
Implementation Method 1
one of the first top surface and the first inner side surface includes at least one first flow hole extending outward therefrom such that the edge ring has the first flow hole penetrating therethrough
Data Source
AI summary
A ring assembly and a chuck assembly therewith are provided. The ring assembly may include an edge ring that is provided to enclose a chuck body supporting a substrate. The edge ring may include a first top surface, a second top surface positioned outside the first top surface and above the first top surface, a first inner side surface connecting the first top surface to the second top surface, and at least one first flow hole extending outward from one of the first top surface and the first inner side surface, thereby penetrating the edge ring.