Rotatable Edge Ring Flow Conductance Tuning in Vapor Deposition Chambers
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Solution Overview
Problem
Existing substrate processing chambers lack the ability to achieve a wide range of pressures, precise pressure transitions, and in-situ adjustability of flow conductance, leading to non-uniform film thickness during semiconductor fabrication.
Innovation Solution
A substrate processing chamber with a gas distribution assembly featuring a rotatable edge ring and concentric pumping liner walls, allowing for in-situ adjustment of gas flow conductance by varying the alignment of openings, enabling uniform precursor distribution and film formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a fixed pumping liner is used, then the chamber structure is simple, but the flow conductance cannot be adjusted in-situ
Solution Approach 1:
The pumping liner is designed with a rotatable edge ring that can be dynamically adjusted during the deposition process. The edge ring contains adjustable openings that can be rotated to different angular positions to vary the flow conductance of the pumping liner in-situ, allowing dynamic adaptation to different process requirements without changing the overall chamber structure.
Solution Approach 2:
The pumping liner is segmented into multiple functional components: the inner pumping liner wall with fixed openings, the rotatable edge ring with adjustable openings, and the outer pumping liner wall. This segmentation allows independent adjustment of flow conductance through the edge ring while maintaining the structural integrity of the pumping liner system.
2Adaptability or versatility
If a throttle valve is used to control pressure, then pressure can be adjusted, but the pressure tunability is limited
Solution Approach 1:
The system changes the geometric parameters of the pumping liner openings by rotating the edge ring to different angular positions. This parameter change allows continuous adjustment of flow conductance and pressure within a wide range, providing both broad pressure adaptability and precise control through incremental rotation adjustments.
3Manufacturing precision
If the edge ring openings are aligned with the pumping liner wall openings, then gas flow conductance is maximized, but uniform precursor distribution cannot be achieved
Solution Approach 1:
The edge ring can be rotated to dynamically adjust the alignment between its openings and the pumping liner wall openings. By optimizing this alignment, the system achieves uniform precursor distribution across the substrate while maintaining adequate gas flow conductance, allowing dynamic balance between uniformity and productivity.
Solution Approach 2:
The openings in the edge ring and pumping liner wall are strategically positioned at different radial and angular locations. This local quality differentiation ensures that gas flow is distributed uniformly across the substrate surface, with each local region receiving appropriate precursor flux for uniform film deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a wider range of operating pressures, precise pressure control, and uniform film thickness across substrates by allowing in-situ adjustment of gas flow conductance without disrupting the vacuum environment.
Implementation Method 1
rotation of the edge ring varies a flow conductance through the pumping liner by varying a degree of alignment of at least a portion of the plurality of the edge ring openings and the plurality of inner pumping liner wall openings
Implementation Method 2
a pumping liner disposed within the substrate processing chamber
Implementation Method 3
the chemical reaction rate is impacted by processing chamber pressure as gas flow
Data Source
AI summary
Substrate processing chamber gas distribution assemblies and methods utilizing of processing substrates using the same are described. The gas distribution assembly includes an edge ring having a plurality of edge ring openings disposed on the outer peripheral portion and an inner pumping liner including a pumping liner wall concentric with the edge ring and an outer pumping liner wall, the inner pumping liner wall and the outer pumping liner wall defining a pumping liner, the inner pumping liner wall having a plurality of inner pumping liner wall openings. Rotation of the edge ring provides in situ flow conductance through the pumping liner.