Edge Ring Gap Plasma Cleaning for Faster Chamber Maintenance
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Solution Overview
Problem
Current plasma processing apparatuses face inefficiencies in cleaning deposits from tiny gaps between components, leading to decreased throughput due to lengthy cleaning times and potential damage to surfaces during plasma exposure.
Innovation Solution
A plasma processing apparatus with a controller that moves the edge ring to a first position spaced apart from the substrate support, generates a local plasma using a cleaning gas and power supply, effectively cleaning the edge ring and substrate support while minimizing surface damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plasma cleaning is performed on deposits between the edge ring and substrate support, then cleaning effectiveness is improved, but processing time increases and surface damage risk increases
Solution Approach 1:
The patent applies local plasma generation between the edge ring and substrate support by controlling the edge ring position and applying RF power selectively. This localized approach concentrates cleaning energy where deposits exist while minimizing exposure of other surfaces, thereby improving cleaning effectiveness without requiring extended processing time across the entire chamber.
Solution Approach 2:
The edge ring is dynamically positioned between a first position (spaced apart from substrate support) and a second position (contacting substrate support) during the cleaning process. This dynamic movement enables controlled plasma generation in the gap area, allowing efficient deposit removal while limiting overall plasma exposure time and reducing surface damage risk.
2Reliability
If plasma cleaning is performed on deposits between the edge ring and substrate support, then cleaning effectiveness is improved, but surface damage increases
Solution Approach 1:
By generating plasma locally in the gap between the edge ring and substrate support rather than throughout the entire chamber, the harmful effects of plasma exposure are confined to the specific area where cleaning is needed. This localized plasma generation minimizes surface damage to other components while maintaining effective deposit removal.
Solution Approach 2:
The dynamic positioning of the edge ring between first and second positions allows precise control over plasma generation location and duration. Plasma is generated only when the edge ring is in the first position with a specific gap to the substrate support, and the process is terminated when the edge ring contacts the substrate support, thereby limiting surface damage while achieving thorough cleaning.
3Productivity
If the edge ring is moved to the first position spaced apart from the substrate support, then local plasma generation is enabled, but device complexity increases
Solution Approach 1:
The edge ring serves multiple functions: it maintains substrate positioning during processing, and it acts as a movable electrode for plasma generation during cleaning. This multi-functionality eliminates the need for separate cleaning mechanisms, reducing overall device complexity while enabling efficient local plasma cleaning through the existing edge ring actuation system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly improves cleaning efficiency by generating a local plasma to remove deposits from the edge ring and substrate support, reducing overall processing time and preventing surface damage.
Implementation Method 1
supply a power to the substrate support while supplying a cleaning gas into the plasma processing chamber to generate a local plasma in a gap between the edge ring maintained at the first position and the substrate support
Data Source
AI summary
A plasma processing apparatus includes: a plasma processing chamber; a substrate support disposed in the plasma processing chamber; an edge ring disposed on the substrate support to surround a substrate on the substrate support; an actuator configured to vertically move the edge ring; a gas supply configured to supply a cleaning gas into the plasma processing chamber; a power source configured to supply a power to the substrate support; and a controller configured to: (a) maintain the edge ring at a first position spaced apart from the substrate support; and (b) supply a power to the substrate support while supplying the cleaning gas into the plasma processing chamber to generate a local plasma in a gap between the edge ring maintained at the first position and the substrate support, thereby cleaning the edge ring and the substrate support.