Edge Ring Height Estimation Using Jig Substrate Reference

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Existing methods for estimating the height of annular members such as edge rings in plasma processing systems are inaccurate due to uneven substrate support surfaces and variations in substrate attraction forces, leading to inconsistent plasma processing results.

Innovation Solution

A method involving a plasma processing system with a transfer robot and distance sensor to measure the height of an annular member by using a jig substrate as a reference, applying voltage to attract the jig substrate electrostatically, and calculating the annular member's height based on measured distances.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a distance sensor is used to measure the height of an annular member, then measurement speed is improved, but measurement precision deteriorates due to uneven substrate support surfaces and variations in substrate attraction forces

Engineering Contradiction:

Improvemeasurement speedVSAvoidheight measurement accuracy

Core Design Contradiction:

SpeedVSMeasurement precision

Solution Approach 1:

The patent creates a virtual copy of the substrate support surface by measuring distances at multiple points and generating height map data. This digital replica allows the system to compensate for surface irregularities and calculate accurate annular member heights despite physical measurement variations, thereby maintaining measurement precision while using fast distance sensing methods.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The system changes the measurement parameters by taking multiple distance measurements at different locations and times, then processing these variations through height map generation. By transforming raw distance data into contextualized height information relative to the support surface, the system achieves precise measurements without sacrificing measurement speed.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If voltage is applied to the electrostatic chuck to attract the substrate, then substrate holding stability is improved, but measurement consistency deteriorates due to varying attraction forces affecting substrate position

Engineering Contradiction:

Improvesubstrate holding stabilityVSAvoidmeasurement consistency

Core Design Contradiction:

Stability of the object's compositionVSMeasurement precision

Solution Approach 1:

The patent replaces direct mechanical contact measurement methods with electrostatic field-based distance sensing. By using a distance sensor that measures through the electrostatic field without physical contact, the system can accurately measure substrate and annular member positions while the electrostatic chuck maintains its variable attraction forces for stable substrate holding, thus resolving the contradiction between holding stability and measurement consistency.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Adaptability or versatility

If the substrate support surface is made uneven to accommodate different substrates, then adaptability is improved, but measurement accuracy deteriorates due to reference surface irregularities

Engineering Contradiction:

Improvesubstrate compatibilityVSAvoidheight measurement accuracy

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The patent performs preliminary mapping of the substrate support surface characteristics before conducting height measurements of the annular member. By预先 creating a height map that captures the uneven surface geometry, the system can later reference this baseline data to accurately determine annular member heights relative to the actual support surface, thereby maintaining measurement accuracy despite surface irregularities that enable substrate adaptability.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Accurately estimates the height of annular members, ensuring consistent plasma processing by compensating for uneven substrate support surfaces and varying attraction forces.

Implementation Method 1

an electrostatic chuck configured to electrostatically attract the substrate to the substrate placing surface

Methodology Applied

Scientific EffectElectrostatic attraction: Electrostatics

Implementation Method 2

a distance sensor provided on the holder and configured to measure a distance from the holder

Methodology Applied

Scientific EffectLight reflection: Reflection

Data Source

PatentUS20260011537A1Plasma processing system and method for estimating height of annular member

Publication Date: 2026.01.08 TOKYO ELECTRON LTD

AI summary

A plasma processing system includes control circuitry that executes (A) loading a jig substrate having a reference surface serving as a reference of the height of an annular member into the processing container and placing a jig substrate on a substrate support, (B) applying a voltage to a electrostatic chuck in a state where the gas is supplied into a processing container and attracting the jig substrate to a substrate placing surface in a plasma-less manner, (C) positioning a holder of a transfer robot above the substrate support and measuring, by a distance sensor, a distance to the reference surface of the jig substrate placed on the substrate placing surface and a distance to the annular member attached to the substrate support, and (D) estimating the height of the annular member based on measurement results of the distance to the reference surface and the distance to the annular member.