Plasma Exposed Edge Ring With In Situ Protective Liquid Layer
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Solution Overview
Problem
Plasma processing chambers face challenges such as significant ion bombardment and nonuniform etch rates across semiconductor substrates, leading to erosion, corrosion, and increased part replacement costs due to nonuniform plasma density and temperature distribution.
Innovation Solution
A component with a plasma-compatible liquid layer on its exposed surfaces, replenished in situ during processing, is used to form a protective layer on the edge ring assembly, which extends its lifespan and maintains uniform plasma conditions by controlling temperature and impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If plasma processing is performed in a vacuum chamber, then semiconductor substrates can be etched and deposited, but significant ion bombardment causes erosion and corrosion of plasma-exposed surfaces
Solution Approach 1:
A protective liquid layer is pre-formed on the plasma-exposed surfaces of components such as the edge ring assembly before plasma processing begins. This preliminary protective layer prevents ion bombardment erosion during the plasma process, allowing the chamber to maintain productivity while protecting surfaces from harmful effects.
Solution Approach 2:
A liquid intermediary substance is introduced between the plasma environment and the component surfaces. This liquid layer acts as a mediator that absorbs ion bombardment energy and prevents direct contact between reactive plasma species and the solid surfaces, thereby reducing erosion and corrosion while maintaining plasma processing effectiveness.
2Manufacturing precision
If edge ring assembly is used to control temperature and plasma distribution, then etch rate uniformity improves, but the assembly suffers from erosion and requires frequent replacement
Solution Approach 1:
The protective liquid layer is applied to the edge ring assembly before plasma processing to prevent erosion during operation. This allows the assembly to maintain its temperature control and plasma distribution functions for extended periods, significantly increasing its operational lifespan while preserving etch rate uniformity.
Solution Approach 2:
The system includes means for automatically replenishing the protective liquid layer during plasma processing operations. This self-service mechanism ensures continuous protection of the edge ring assembly without requiring manual intervention or shutdown, maintaining both etch uniformity and extending component life through continuous erosion prevention.
3Reliability
If plasma compatible liquid is supplied to form protective layer, then component erosion is prevented, but system complexity increases due to liquid supply infrastructure
Solution Approach 1:
The system is designed with automatic liquid replenishment capabilities that operate during plasma processing without manual intervention. The liquid supply infrastructure includes reservoirs, delivery mechanisms, and sensors that automatically maintain the protective liquid layer, reducing the operational burden despite the added system complexity.
Solution Approach 2:
The liquid supply system is integrated with existing plasma processing infrastructure, where the same liquid delivery mechanisms serve multiple functions including protective layer formation, temperature control, and component cooling. This multi-functionality reduces the net increase in system complexity while maintaining reliable erosion protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective liquid layer prevents erosion, maintains uniform plasma conditions, and extends the RF lifetime of the edge ring assembly, reducing part replacement costs and improving etch rate uniformity across the substrate.
Implementation Method 1
the plasma etch conditions create significant ion bombardment of the surfaces of the processing chamber
Implementation Method 2
The protective liquid layer is cured on the plasma exposed surface of the component thereby forming the protective solid layer
Implementation Method 3
heating a plasma compatible solid to form a plasma compatible liquid
Implementation Method 4
The protective liquid layer on the plasma exposed surface of the component is cooled, thereby forming the protective solid layer
Data Source
AI summary
A component of a plasma processing chamber having a protective liquid layer on a plasma exposed surface of the component The protective liquid layer can be replenished by supplying a liquid to a liquid channel and delivering the liquid through liquid feed passages in the component. The component can be an edge ring which surrounds a semiconductor substrate supported on a substrate support in a plasma processing apparatus wherein plasma is generated and used to process the semiconductor substrate. Alternatively, the protective liquid layer can be cured or cooled sufficiently to form a solid protective layer.