3D Edge Ring Restoration for Reduced Plasma Etching Downtime
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Solution Overview
Problem
High-aspect ratio etching and miniaturization in plasma processing require efficient methods to manage and restore consumable components, such as the edge ring, which are consumed during the process, leading to increased costs and downtime due to frequent replacements.
Innovation Solution
A forming method using a 3D printer that irradiates an energy beam to a source material of the component, guided by three-dimensional data on the component's consumption or surface state, allowing for restoration and reformation of components like the edge ring, extending their lifespan and reducing manufacturing lead time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If consumable components are used in plasma processing apparatus, then high-aspect ratio etching and miniaturization can be achieved, but the components are consumed during the process requiring frequent replacements which increases costs and downtime
Solution Approach 1:
The patent applies the discarding and recovering principle by capturing consumed component particles from the plasma processing environment and reusing them to restore worn components. Instead of discarding consumed particles as waste, the system recovers them through filtration and reconstruction processes, thereby extending component life and reducing replacement frequency while maintaining etching precision.
Solution Approach 2:
The patent replaces manual mechanical component replacement with an automated particle-based restoration system. Rather than physically removing and replacing entire components, the system uses plasma and particle deposition mechanisms to restore component surfaces in-situ, eliminating downtime associated with mechanical replacement operations.
2Reliability
If consumable components are frequently replaced, then operational continuity is maintained, but manufacturing costs increase and lead time extends
Solution Approach 1:
The patent implements self-service by enabling components to restore themselves through automated particle deposition systems. The consumed particles are automatically captured, processed, and redeposited onto component surfaces without external intervention, allowing components to maintain their own functionality and extend their service life while preserving operational continuity.
Solution Approach 2:
The patent ensures continuity of useful action by implementing continuous particle circulation and component restoration during plasma processing operations. Rather than interrupting production for component replacement, the system maintains continuous operation by constantly replenishing consumed component material through particle deposition, thereby eliminating downtime and improving manufacturing efficiency.
3Duration of action of stationary object
If component lifespan is extended through restoration, then replacement frequency decreases, but additional processing steps are required
Solution Approach 1:
The patent merges the component restoration process with the existing plasma processing workflow. The particle capture, processing, and deposition operations are integrated into the same chamber and operational cycle used for semiconductor manufacturing, eliminating the need for separate restoration equipment and procedures. This integration extends component lifespan without significantly increasing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the restoration of consumable components within the plasma processing apparatus, reducing the need for frequent replacements and extending their operational life, while also minimizing downtime and lead times in manufacturing.
Implementation Method 1
irradiating an energy beam to a source material of the component
Implementation Method 2
irradiating an energy beam to a source material of the component while supplying the source material based on a surface state of the component
Implementation Method 3
there is performed a plasma process in which a high frequency power for bias voltage generation is supplied at a high power level
Implementation Method 4
the high aspect ratio etching and miniaturization can be realized by increasing the attraction of ions onto a substrate
Data Source
AI summary
A forming method of a component used in a plasma processing apparatus includes irradiating an energy beam to a source material of the component while supplying the source material based on a surface state of the component.