Edge Ring Electrode Layout for Stable Sheath Positioning

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Solution Overview

Problem

Existing substrate processing apparatuses face challenges in stably applying voltage to the edge ring, which affects the consistency and efficiency of plasma processing.

Innovation Solution

A substrate support is designed with a conductive electrode formed on the edge ring mounting surface, allowing for stable voltage application to the edge ring, and an electrostatic chuck is used to attract and hold the edge ring in place.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a DC voltage is applied to the focus ring to adjust the sheath position, then the sheath position can be controlled, but the voltage application becomes unstable

Engineering Contradiction:
Improvevoltage application stabilityVSAvoidelectrode configuration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The electrode is divided into multiple segments: a first electrode on the inner surface of the edge ring and a second electrode on the outer surface of the edge ring. This segmentation allows independent voltage application to different surfaces, enabling stable and flexible voltage control for sheath position adjustment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The edge ring acts as an intermediary component between the electrodes and the sheath. By placing electrodes on both the inner and outer surfaces of the edge ring, the system can apply voltage through the edge ring to stabilize the sheath position more effectively.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If voltage is applied to the edge ring, then the sheath position can be adjusted, but the edge ring may deform or shift

Engineering Contradiction:
Improvesheath position consistencyVSAvoidedge ring positional stability
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

Electrodes are placed at specific locations on the edge ring (inner and outer surfaces) rather than uniformly across the entire edge ring. This localized electrode placement allows voltage to be applied precisely where needed to control sheath position without causing unnecessary stress or deformation to the edge ring structure.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The system allows dynamic adjustment of voltage applied to different electrode surfaces based on processing requirements. By independently controlling the voltage on the inner and outer electrodes, the system can adaptively maintain edge ring stability while achieving precise sheath position control.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures stable and reproducible power feeding to the edge ring, maintaining the position of the sheath and preventing deformation or shifting, thereby enhancing the overall efficiency and consistency of plasma processing.

Implementation Method 1

a conductive electrode formed on the edge ring mounting surface and configured to provide a voltage to the edge ring

Methodology Applied
Scientific EffectElectric field: Electric Field

Implementation Method 2

an electrostatic chuck is used to attract and hold the edge ring in place

Methodology Applied
Scientific EffectElectrostatic attraction: Electrostatics

Data Source

PatentUS12266511B2Substrate support and substrate processing apparatus
Publication Date: 2025.04.01 TOKYO ELECTRON LTD
  • US12266511B2 patent drawing
  • US12266511B2 patent drawing
  • US12266511B2 patent drawing

AI summary

Provided is a technique for stably applying a voltage to an edge ring. Provided is a substrate support including: a substrate mounting surface on which a substrate is mounted; an edge ring mounting surface on which an edge ring is mounted around the substrate mounting surface; and a conductive electrode formed on the edge ring mounting surface and configured to apply a voltage to the edge ring.