Edge Ring Thermal Management via Intermediary Heat Transfer Path
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Solution Overview
Problem
Conventional semiconductor process chambers experience temperature non-uniformities due to edge rings with different thermal properties compared to substrate supports, leading to non-uniform substrate processing.
Innovation Solution
A second ring is disposed between the substrate support and the first ring to provide a heat transfer path, allowing for controlled temperature management and minimizing temperature differences by using materials with high thermal conductivity and heat capacity, such as ceramics, and incorporating heat transfer fluids or embedded heaters for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an edge ring is used to secure the substrate during processing, then the substrate positioning is improved, but temperature non-uniformities occur due to different thermal properties between the edge ring and substrate support
Solution Approach 1:
The edge ring structure is divided into multiple segments (first edge ring segment and second edge ring segment) that can be independently controlled. This segmentation allows different thermal management strategies to be applied to different regions, enabling precise temperature control while maintaining substrate positioning functionality.
Solution Approach 2:
A thermal management system with temperature control elements is introduced as an intermediary between the edge ring and the substrate support. This intermediary component regulates heat flow to the edge ring, ensuring temperature uniformity across the substrate processing area while the edge ring maintains its positioning function.
2Productivity
If the edge ring is heated to higher temperature during processing due to process heat or upper electrode heating, then the processing capability is improved, but temperature non-uniformities increase
Solution Approach 1:
A temperature control system with sensors and actuators is implemented to provide feedback control of the edge ring temperature. The system continuously monitors temperature conditions and adjusts heating or cooling to maintain uniform temperature distribution, even when process conditions cause temperature variations.
Solution Approach 2:
The thermal properties of the edge ring are modified by introducing temperature control elements that can dynamically adjust thermal parameters. This allows the edge ring to maintain optimal temperature characteristics during processing, preventing excessive heating while preserving processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution ensures uniform heating and cooling of substrates during processing by regulating the temperature of the edge ring, thereby improving processing consistency and reducing thermal non-uniformities.
Implementation Method 1
a second ring disposed between the substrate support and the first ring, the second ring configured to provide a heat transfer path from the first ring to the substrate support
Data Source
AI summary
Apparatus for processing semiconductors are provided herein. In some embodiments, an apparatus for processing a substrate may include: a first ring disposed concentrically about a substrate support, the first ring configured to position a substrate atop the substrate support during processing; and a second ring disposed between the substrate support and the first ring, the second ring configured to provide a heat transfer path from the first ring to the substrate support.