Edge Ring Voltage Control for Plasma Deposit Removal
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Solution Overview
Problem
In plasma processing, there is a challenge in removing deposits on the outer peripheral member while minimizing abrasion, as continuous application of voltage to the edge ring leads to premature wear and tilting due to uneven ion incidence angles.
Innovation Solution
A method involving a plasma processing apparatus where the deposition status on the edge ring is monitored, and voltage application is controlled based on the monitored status to intermittently apply DC voltage, reducing abrasion and effectively removing deposits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If voltage is continuously applied to the outer peripheral member to remove deposits, then deposit removal efficiency is improved, but abrasion of the outer peripheral member increases
Solution Approach 1:
The patent applies voltage to the outer peripheral member intermittently rather than continuously. The voltage application is controlled based on monitored deposition film status, applying voltage only when deposits reach a certain thickness threshold. This periodic action removes deposits effectively while minimizing unnecessary voltage application that would cause abrasion and wear to the outer peripheral member.
2Productivity
If voltage is applied to the outer peripheral member to remove deposits, then deposit removal is improved, but uniformity of ion incidence angle deteriorates
Solution Approach 1:
The patent incorporates a monitoring mechanism that detects the deposition film status on the outer peripheral member in real-time. Based on this feedback information, the voltage application is dynamically controlled - voltage is applied only when the deposited film reaches a predetermined thickness. This feedback control ensures deposits are removed effectively while maintaining uniform ion incidence angles by avoiding excessive or unnecessary voltage application that would disrupt the plasma field uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the abrasion of the edge ring, maintains process characteristics, and ensures uniform etch rates by adjusting RF power settings, thereby preventing tilting and maintaining the integrity of the edge ring and wafer processing.
Implementation Method 1
a step of exposing the object to a plasma containing a precursor having a deposition property... a deposition film containing carbon that is deposited on the outer peripheral member
Implementation Method 2
a first power supply configured to apply voltage to the outer peripheral member... the voltage applied to the outer peripheral member is controlled based on the monitored status of the deposition film
Data Source
AI summary
A method of processing an object using a plasma processing apparatus is provided. The plasma processing apparatus includes a stage on which the object is placed in a chamber, an outer peripheral member disposed around the stage, and a first power supply configured to apply voltage to the outer peripheral member. The method includes a step of exposing the object to a plasma containing a precursor having a deposition property, while applying voltage from the first power supply to the outer peripheral member. In applying voltage to the outer peripheral member, a status of a deposition film containing carbon that is deposited on the outer peripheral member is monitored, and the voltage applied to the outer peripheral member is controlled based on the monitored status of the deposition film.