Edge Surface Antenna Elements on Multilayer Circuit Boards
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Solution Overview
Problem
Existing multilayer circuit boards face challenges in manufacturing and alignment when integrating edge surface antenna elements, particularly due to high manufacturing costs and alignment issues in methods like those disclosed in U.S. Patent Application Publication No. 2007/0107935, and space constraints in applications where separate interconnector components are not feasible.
Innovation Solution
The integration of antenna elements on the edge surfaces of multilayer circuit boards, where conductive traces with exposed ends are covered with an electrically conductive layer and selectively removed using laser ablation to define pads, allowing for cost-effective and accurate manufacturing without the need for separate interconnectors, enabling efficient coupling to wireless processing circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate interconnector components are used to interconnect circuit boards, then electrical coupling is achieved, but device size increases and space is consumed
Solution Approach 1:
The patent merges the interconnector function with the circuit board itself by forming conductive pads directly on the edge surface of the circuit board. This eliminates the need for separate interconnector components while maintaining electrical coupling capability, thereby reducing device size and space consumption.
Solution Approach 2:
The circuit board is designed to serve multiple functions: it provides mechanical support, electrical connections through internal traces, and direct edge surface coupling capability. By integrating the interconnector function into the circuit board structure, the board becomes a multi-functional component that eliminates the need for dedicated interconnector parts.
2Reliability
If conventional via drilling and filling methods are used to create edge surface contact pads, then electrical coupling is achieved, but manufacturing cost increases and alignment precision requirements increase
Solution Approach 1:
The patent extracts the complex via drilling and filling process by using an alternative approach: depositing conductive material directly on the edge surface and selectively removing portions. This eliminates the need for precise via alignment and reduces manufacturing steps, thereby lowering production costs and simplifying the fabrication process.
Solution Approach 2:
Instead of the conventional approach of drilling vias and filling them with conductive material, the patent inverts the process by first depositing a continuous conductive layer and then selectively removing portions to form the desired pad patterns. This inversion simplifies the manufacturing process and reduces alignment requirements.
3Reliability
If conventional via drilling and filling methods are used to create edge surface contact pads, then electrical coupling is achieved, but manufacturing complexity and alignment requirements increase
Solution Approach 1:
The patent removes the complex multi-step via drilling and filling process by adopting a simplified approach: depositing conductive material on the edge surface and selectively removing portions. This extraction of the complex process reduces fabrication steps and alignment requirements, thereby lowering manufacturing complexity.
4Reliability
If conductive traces extend beyond the edge surface with gaps, then electrical coupling is achieved, but manufacturing precision requirements increase
Solution Approach 1:
Instead of extending traces beyond the edge with gaps that require precise alignment, the patent inverts the approach by forming continuous conductive pads directly on the edge surface. This eliminates the gap alignment issue and reduces manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the cost-effective and accurate manufacturing of multilayer circuit boards with edge surface antenna elements, reducing manufacturing costs and alignment complexities, while enabling efficient coupling to wireless processing circuitry, thereby enhancing the integration of antenna elements in compact applications.
Implementation Method 1
selectively removing portions of the electrically conductive layer to define the antenna element
Data Source
AI summary
An electronic device may include a multilayer circuit board having opposing major surfaces and edge surfaces extending between the opposing major surfaces, wireless processing circuitry on at least one of the opposing major surfaces, and an antenna element on at least one of the edge surfaces. The multilayer circuit board may include a conductive trace coupling the antenna element to the wireless processing circuitry.