EFEM Buffer Station Layout for Wafer Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, the increase in wafer diameter from 300-mm to 450-mm poses challenges in handling more wafers without increasing the size of the wafer transfer robot and the footprint of the Equipment Front End Module (EFEM), as larger wafers require increased storage space and strength, but enlarging the buffer stations' height dimension leads to increased robot size and footprint.
Innovation Solution
A novel layout where two buffer stations are disposed next to each other in the front-rear direction on at least one side surface of the wafer transfer chamber, allowing for increased wafer storage capacity without necessitating an increase in the up-down stroke distance of the wafer transfer robot or the overall footprint, by maintaining the same size specifications as conventional robots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the height dimension of buffer stations is increased to increase storage space, then the number of wafers that can be stored increases, but the up-down stroke distance of the wafer transfer robot increases, leading to increased robot size and footprint
Solution Approach 1:
The patent transitions from vertical stacking (height dimension) to horizontal arrangement (front-rear direction) for buffer stations. By disposing two buffer stations adjacent to each other in the front-rear direction on the side surface of the wafer transfer chamber, the system increases wafer storage capacity without increasing the vertical stroke distance of the robot, thus resolving the contradiction between storage quantity and robot size.
2Quantity of substance
If the height dimension of buffer stations is increased to increase storage space, then the number of wafers that can be stored increases, but the footprint of the EFEM increases
Solution Approach 1:
The patent utilizes the front-rear direction (depth dimension) of the wafer transfer chamber side surface to dispose buffer stations horizontally rather than stacking them vertically. This dimensional change allows increased wafer storage capacity while maintaining a compact footprint, as the buffer stations are arranged along the depth of the chamber rather than extending the overall equipment footprint.
3Strength
If the wafer transfer robot size is increased to enhance strength for handling larger wafers, then the handling capability improves, but the robot size and chamber size increase
Solution Approach 1:
The patent segments the wafer storage function into multiple separate buffer stations disposed horizontally, rather than requiring a single large-capacity buffer station. This segmentation allows the use of a smaller, more compact wafer transfer robot that can efficiently transfer wafers between multiple smaller buffer stations, reducing the overall robot size while maintaining the capability to handle increased total wafer capacity.
Data Source
AI summary
An EFEM 1 includes a wafer transfer chamber 3 having an interior space in which a wafer transfer robot 5 is disposed and load ports 2 disposed adjacent to a front surface 32 of the wafer transfer chamber 3, and semiconductor processing equipment M can be disposed adjacent to a rear surface 33 of the wafer transfer chamber 3. The EFEM 1 has a configuration in which two buffer stations 4 capable of temporarily storing wafers W are disposed next to each other in the front-rear direction A on a side surface 31 of the wafer transfer chamber 3. The EFEM 1 thus configured adapts to an increase in wafer diameter and is capable of handling many wafers while preventing or minimizing an increase in the stroke distance in the height direction of the wafer transfer robot 5 and an increase in the footprint of the entire EFEM 1.