EFEM Curved Chamber Surface for Gas Flow
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Solution Overview
Problem
Existing equipment front end modules (EFEMs) for wafer transfer in semiconductor manufacturing face challenges in maintaining cleanliness due to inefficient gas flow and potential contamination from residual fumes in the wafer transfer chamber, leading to equipment corrosion and wafer contamination.
Innovation Solution
The EFEM incorporates a wafer transfer chamber with curved surface portions on its inner surface to facilitate efficient gas flow and exhaust, featuring a delivery unit and exhaust unit with airflow guide portions, and uses a polymer material for the curved surfaces that are detachable and coated for enhanced durability and ease of replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a box-type wafer transfer chamber is used, then the structure is simple and easy to manufacture, but gas flow efficiency deteriorates causing fume retention and contamination
Solution Approach 1:
The patent applies curvature by forming streamlined curved surface portions on the inner surface of the wafer transfer chamber, replacing the conventional box-type flat surfaces. This curvature design guides gas flow smoothly along the chamber walls, preventing dead zones where fumes would accumulate, thereby improving gas flow efficiency and exhaust performance while maintaining manufacturing feasibility through molding or coating processes
2Reliability
If gases are supplied into the wafer transfer chamber for cleanliness management, then wafer contamination is prevented, but harmful fumes remain in the chamber corners and bottom
Solution Approach 1:
The patent applies local quality by creating specific curved surface portions at critical locations where gas flow needs enhancement. The curved surfaces are strategically positioned on the inner wall to guide gas flow into dead zones and corners, ensuring uniform distribution and preventing fume accumulation in specific areas while maintaining overall cleanliness
3Reliability
If the wafer transfer chamber interior is contaminated with fumes, then wafer contamination occurs and equipment corrosion damages the chamber
Solution Approach 1:
The patent applies preliminary anti-action by proactively designing curved surface portions that prevent fume accumulation before contamination can occur. The streamlined surfaces guide gas flow to continuously sweep the chamber interior, preventing harmful fumes from settling on wafers or corroding the chamber walls, thereby extending equipment lifespan and maintaining wafer cleanliness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures efficient gas flow and exhaust, preventing fume retention and contamination, maintaining high cleanliness levels and extending equipment lifespan by preventing corrosion and facilitating easy maintenance.
Implementation Method 1
curved surface portions having a streamlined shape are provided on at least a part of an inner surface of the wafer transfer chamber
Data Source
AI summary
The present invention relates to an equipment front end module (EFEM) configured to perform wafer transfer between process equipment and a wafer storage device that stores wafers. More particularly, the present invention relates to an equipment front end module (EFEM), which enables gases supplied into the wafer transfer chamber to efficiently flow to maintain cleanness in the wafer transfer chamber at a high level, thus preventing contamination in the wafer transfer chamber.