EFEM Gas Barrier Flow Control for Low-Humidity Wafer Loading
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Solution Overview
Problem
In semiconductor manufacturing, the introduction of external air into the wafer container can lead to increased humidity, oxidation of wafer surfaces, and contamination, which complicates the load port configuration and reduces semiconductor yield.
Innovation Solution
A device for controlling the gas flow in the equipment front end module (EFEM) is installed at the entrance of the wafer container, forming a blocking gas layer to prevent external air introduction, and using multiple gas layers to stabilize the gas flow and reduce humidity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If external air is introduced into the wafer container to maintain atmospheric environment, then the wafer container can be accessed for loading/unloading wafers, but humidity increases and wafer surfaces oxidize
Solution Approach 1:
The patent introduces a blocking gas layer (inert atmosphere) at the entrance of the wafer container to prevent external air from entering. This inert gas barrier maintains the internal atmosphere while allowing access for wafer loading and unloading, thus preventing oxidation and contamination of wafer surfaces during the access operation.
Solution Approach 2:
The blocking gas layer acts as an intermediary substance between the external air and the internal environment of the wafer container. This gas barrier mediates the interaction by blocking harmful external air from entering while permitting necessary access operations, thereby protecting wafers from oxidation and contamination.
2Object-affected harmful factors
If a double door opening/closing unit is provided to block external air, then external air introduction is prevented, but the load port configuration becomes complicated
Solution Approach 1:
The patent extracts the air blocking function from the mechanical door structure and implements it through a gas barrier layer. Instead of using complex double door mechanisms, the blocking function is achieved by introducing a blocking gas layer at the entrance, thereby simplifying the load port configuration while maintaining effective external air blocking.
Solution Approach 2:
The patent uses a pneumatic approach by introducing a blocking gas layer to achieve air sealing, replacing the need for complex mechanical door structures. This pneumatic sealing method simplifies the load port configuration while effectively preventing external air from entering the wafer container.
3Ease of operation
If the door of wafer container is opened for loading/unloading, then wafer access is enabled, but internal humidity increases due to external air introduction
Solution Approach 1:
The patent maintains an inert atmosphere inside the wafer container by introducing a blocking gas layer at the entrance. This prevents external humid air from entering during door opening for loading/unloading operations, thereby keeping internal humidity at acceptable levels while enabling easy wafer access.
Solution Approach 2:
The blocking gas layer serves as an intermediary barrier that prevents humid external air from entering the wafer container during door opening. This gas barrier mediates between the need for door opening (for wafer access) and the need to maintain low internal humidity, allowing both requirements to be satisfied simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively blocks external air, reduces humidity, and stabilizes the gas flow, thereby improving semiconductor manufacturing yield and simplifying the load port configuration.
Implementation Method 1
supplying a blocking gas layer at an entrance to block an introduction of external air
Implementation Method 2
supplying a gas so as to stabilize the gas flow
Implementation Method 3
the gas supplied into the body part is uniformly dispersed downward in a straight line to discharge the gas, thereby forming a gas layer
Implementation Method 4
forming multiple gas layers by a downward flow in a blower part and an upward flow or inward flow in a nozzle part
Data Source
AI summary
The present invention relates to a device for controlling a gas flow of an equipment front end module (EFEM), which is installed at one side or each of both sides of an internal space of the EFEM to form a gas layer at an entrance, through which a wafer is loaded and unloaded, and a semiconductor process apparatus including the same, and includes a body part installed at an upper portion of a front surface of the entrance, a blower part configured to blow the gas so that the gas is supplied into the body part, a dispersion part installed at a lower portion of the body part. Thus, the present invention may provide an effect of blocking an introduction of external air by installing the body part, the blower part, and the dispersion part at one side or both sides in the internal space of the EFEM to form the gas layer at the entrance of the wafer, thereby forming a blocking gas layer at the entrance so as to reduce humidity of a wafer container.