EFEM Return Path Redesign for Gas Circulation and Installation Flexibility
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Solution Overview
Problem
Existing EFEMs face challenges in mass production due to restrictions on the installation of incidental facilities and maintenance doors caused by the placement of the return path, which also requires adjustments based on substrate processing apparatus specifications.
Innovation Solution
The EFEM design includes a return path arranged at one end of the transfer chamber, allowing both sides to remain unoccupied, and integrating it within hollow columnar members to minimize space and facilitate installation, with a fan and duct configuration to ensure efficient gas flow and pressure control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the return path is arranged on one side surface of the transfer chamber, then the inert gas circulation is achieved, but the installation of incidental facilities and maintenance doors is restricted
Solution Approach 1:
The return path is relocated from the side surface to the end portion of the transfer chamber in the depth direction. This dimensional change in path arrangement allows incidental facilities and maintenance doors to be installed on the side surfaces without interference, while still achieving effective inert gas circulation through the redesigned flow path configuration.
2Reliability
If the return path is formed by using the back wall of the transfer chamber, then the gas circulation is achieved, but the arrangement position must be changed according to substrate processing apparatus specifications
Solution Approach 1:
The return path is designed as a standardized component integrated into the transfer chamber structure at the end portion, independent of substrate processing apparatus specifications. This universal design allows the same EFEM configuration to be used across different apparatus specifications, eliminating the need to change return path arrangement positions and enabling mass production.
3Reliability
If the return path is arranged on the side surface of the transfer chamber, then the gas flow is achieved, but the EFEM size and installation area increase
Solution Approach 1:
The return path is repositioned to utilize the depth direction space at the end portion of the transfer chamber rather than occupying side surface area. This spatial optimization allows the gas flow function to be maintained while reducing the overall footprint and installation area of the EFEM system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces restrictions on incidental facility installation, eliminates the need for adjusting the return path's position based on substrate processing apparatus specifications, and maintains efficient inert gas circulation while minimizing the EFEM's size and installation area.
Implementation Method 1
a fan filter unit configured to send an inert gas to the transfer chamber
Implementation Method 2
a return path configured to return the inert gas flowing in the transfer chamber to the unit installation chamber
Implementation Method 3
a pressure control unit configured to control a pressure inside the transfer chamber, thereby preventing infiltration of external gas into the transfer chamber
Data Source
AI summary
In an inert-gas circulating type EFEM, generation of any constraints on installation of incidental equipment, a maintenance door, or the like is inhibited, and the need for changing the placement position, etc. of a feedback path according to the specifications, etc. of a substrate processing device connected thereto is eliminated. An EFEM 1 is provided with: a transfer chamber 41 in which a wafer W is conveyed; a unit installation chamber 42 in which a FFU 44 for feeding nitrogen to the transfer chamber 41 is installed; and a return path 43 for feeding the nitrogen having flown through the transfer chamber 41, back to the unit installation chamber 42. A substrate processing apparatus 6 is connected to the rear-side end of the transfer chamber 41. The return path 43 is disposed at the front-side end of the transfer chamber 41.