EFEM Substrate Preheating Chamber for Higher Deposition Throughput

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Solution Overview

Problem

Semiconductor deposition process modules require heating of silicon wafers to achieve process temperatures, which increases processing time and reduces chamber throughput.

Innovation Solution

A substrate preheating module is integrated into the equipment front end module (EFEM) to preheat substrates before processing, utilizing a chamber with a gas inlet, valves for gas control, a heater, and a controller to manage the heating process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If substrates are heated in the deposition process module, then the required process temperature is achieved, but the processing time increases and chamber throughput decreases

Engineering Contradiction:

Improvesubstrate temperatureVSAvoidchamber throughput

Core Design Contradiction:

TemperatureVSProductivity

Solution Approach 1:

The substrate preheating module performs the heating action before the substrate enters the deposition process module. The heater heats substrates to a predetermined temperature in the preheating chamber, so when substrates are transferred to the deposition module, they are already at the required temperature range, eliminating the need for time-consuming in-chamber heating and thereby improving chamber throughput

Inventive Principle:

Principle #10Preliminary action

2Productivity

If substrates are preheated before introduction into the process module, then the chamber throughput is improved, but the device complexity increases

Engineering Contradiction:

Improvesystem throughputVSAvoidmodule structure

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The system is divided into separate functional modules: a substrate preheating module with its own chamber, heater, and gas control system, and the deposition process module. This segmentation allows the preheating function to be performed independently before substrate transfer, improving throughput while keeping each module's complexity manageable and independent

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A transfer mechanism serves as an intermediary between the preheating module and the deposition module. This intermediary component enables substrate transfer between modules without requiring complex integration of all functions into a single chamber, thus improving overall system productivity while maintaining reasonable device complexity through modular design

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The substrate preheating module reduces the time spent in the processing chamber, thereby improving overall system throughput and efficiency.

Implementation Method 1

a heater configured to heat the first gas in the chamber

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Implementation Method 2

the heater comprises an ultra-violet (UV) lamps or an excimer laser

Methodology Applied

Scientific EffectPhotothermal heating: Absorption (EM radiation)

Data Source

PatentUS20250183064A1Substrate preheating module, a device processing assembly with a substrate preheating function and the method of the same

Publication Date: 2025.06.05 ASM IP HLDG BV

AI summary

A substrate preheating module is presented. According to an embodiment of the present disclosure, the module comprising a chamber configured to receive more than one substrates from an equipment front end module (EFEM), a first opening disposed on a wall of the chamber adjacent to the EFEM, a gas inlet configured to deliver a gas from an outer gas source into the chamber, a first valve disposed at the gas inlet and configured to control the input of the gas into the chamber, an exhaust vent configured to pump out the gas from the chamber, a second valve disposed at the exhaust vent and configured to control the exhaust of the gas from the chamber and a heater configured to heat the gas in the chamber. The module may further comprise a controller to control the valves and heater.