EFEM Wafer Handling Module for Automated Destructive Analysis
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Solution Overview
Problem
Current destructive analysis processes for wafers in semiconductor manufacturing are manual, leading to reliability issues, damage to the analysis region, and safety concerns.
Innovation Solution
An Equipment Front End Module (EFEM) is introduced, comprising a base with a tray port, shuttle port, and a working robot that can load and convey trays containing stubs and grid holders, improving automation and efficiency in wafer transportation and analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual processes are used for wafer input, sample fabrication, and analysis, then flexibility and ease of operation are maintained, but reliability deteriorates due to setting errors and damage to the region of interest
Solution Approach 1:
An Equipment Front End Module (EFEM) is introduced as an intermediary automated system between the user and the main destructive analysis device. The EFEM includes a tray port for loading trays with wafers, a shuttle port for transferring samples, and a working robot that automatically conveys wafers from the tray to the shuttle port and loads them into the main device, eliminating manual handling while maintaining system modularity
Solution Approach 2:
The system is divided into distinct functional modules: the EFEM (with tray port, shuttle port, and working robot) and the main destructive analysis device. This segmentation allows the automation function to be isolated in the EFEM while the main device focuses on analysis, reducing overall system complexity while improving reliability through specialized automation
2Productivity
If manual handling of wafers and samples is performed, then device complexity is minimized, but productivity and efficiency deteriorate due to time-consuming manual operations
Solution Approach 1:
The working robot automatically performs all transportation tasks without human intervention. The robot conveys the wafer from the tray to the shuttle port, loads it into the main device, and subsequently conveys the grid holder with the fabricated sample back to the shuttle port for removal. This self-service automation eliminates manual operations while maintaining a relatively simple system architecture
Solution Approach 2:
The working robot performs multiple functions: conveying wafers to the main device, conveying grid holders back to the shuttle port, and facilitating sample transfer. This multi-functionality improves productivity by consolidating transportation tasks into a single automated unit, reducing the need for separate specialized devices
3Object-affected harmful factors
If manual operations are used for wafer processing, then safety risks are minimized in terms of system complexity, but safety deteriorates due to potential damage and handling risks
Solution Approach 1:
The EFEM acts as an intermediary automated handling system that completely takes over wafer and sample transportation from manual operations. The working robot carefully conveys wafers and grid holders between the tray, shuttle port, and main device, eliminating human contact and the associated safety risks of manual handling while maintaining controlled, precise movements
Solution Approach 2:
Manual mechanical handling is replaced with an automated robotic mechanical system. The working robot uses programmed mechanical movements to convey wafers and samples, providing more precise and controlled handling that reduces the risk of damage compared to manual operations, while the modular EFEM design keeps the automation extent manageable
Data Source
AI summary
Provided is an equipment front end module (EFEM) including a base configured to communicate with a processor, a tray port on the base, the tray port being configured to load a tray including a stub and a grid holder, a working robot configured to move in a direction on the base, and grasp and convey the stub in the tray and the grid holder in the tray, and a shuttle port on the base, the shuttle port including a first groove configured to fix the stub, and a second groove configured to fix the grid holder, wherein the working robot is further configured to convey the stub to the first groove and convey the grid holder to the second groove.