E Fuse Repair System for Semiconductor Defect Detection

Solution Overview

Problem

Existing semiconductor module repair systems face challenges in efficiently detecting and repairing defects after the memory chip is sealed, requiring time-consuming and costly processes involving physical extraction and laser-based methods.

Innovation Solution

A repair system and method utilizing electric fuses connected to semiconductor chips, with a defect determination unit, storage unit, and repair unit that compares data between active and idle chips, stores defective positions, and replaces defects using a reset signal to enter rupture mode, allowing for in-place defect repair without physical opening of the module.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of repair

If laser-based fuse cutting is used to repair defects, then defect repair capability is achieved, but the process requires physical extraction and decapsulation of chips, increasing time and cost

Engineering Contradiction:

Improvedefect repair capabilityVSAvoidrepair time

Core Design Contradiction:

Ease of repairVSLoss of time

Solution Approach 1:

The patent replaces the mechanical laser-based fuse cutting process with an electrical field-based E-fuse rupture mechanism. Instead of using laser energy to physically cut fuses, the system applies electrical fields to rupture E-fuses through electrical conduction, eliminating the need for mechanical extraction and decapsulation operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces E-fuses as an intermediary component that can be electrically controlled to isolate defective memory cells. These E-fuses serve as a mediator between the control circuit and the memory array, allowing defect isolation through electrical signals rather than physical manipulation.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Ease of repair

If laser-based fuse cutting is used to repair defects, then defect repair capability is achieved, but the process requires physical extraction and decapsulation of chips, increasing cost

Engineering Contradiction:

Improvedefect repair capabilityVSAvoidmanufacturing cost

Core Design Contradiction:

Ease of repairVSEase of manufacture

Solution Approach 1:

The patent replaces the mechanical laser-based fuse cutting process with an electrical field-based E-fuse rupture mechanism. Instead of using laser energy to physically cut fuses, the system applies electrical fields to rupture E-fuses through electrical conduction, eliminating the need for mechanical extraction and decapsulation operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system enables self-diagnosis and self-repair capabilities through integrated defect detection and E-fuse control circuits. The memory device can automatically identify defective cells and isolate them using E-fuses without requiring external manual intervention, reducing labor costs and simplifying the repair process.

Inventive Principle:

Principle #25Self-service

3Ease of repair

If conventional fuse methods are used, then defect repair is possible, but defects cannot be repaired after the memory chip is sealed in a package

Engineering Contradiction:

Improvedefect repair capabilityVSAvoidpost-packaging repair capability

Core Design Contradiction:

Ease of repairVSAdaptability or versatility

Solution Approach 1:

The patent replaces the mechanical laser-based fuse cutting process with an electrical field-based E-fuse rupture mechanism. Instead of using laser energy to physically cut fuses, the system applies electrical fields to rupture E-fuses through electrical conduction, eliminating the need for mechanical extraction and decapsulation operations.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent transitions from a pre-packaging repair approach to a post-packaging repair capability by implementing E-fuse control through the package interface. This allows defect repair to occur in a different temporal dimension (after packaging) and spatial dimension (through electrical connections rather than physical access).

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient detection and repair of defects within mounted semiconductor modules, improving yield and reducing costs by allowing for in-place correction using electric fuses without physical disassembly.

Implementation Method 1

read the data of a chip that is actually accessed and the data of an idle chip in the data storage regions, compare the actually accessed and read data with the data of the idle chip, and detect a defect based on a result of the comparison

Methodology Applied

Scientific EffectElectrical signal comparison:

Implementation Method 2

a repair unit configured to repair the defect through an E fuse connected to the position of the defect using a reset signal

Methodology Applied

Scientific EffectElectrical rupture of E-fuse:

Data Source

PatentUS9019786B2Repair system for repairing defect using E fuses and method of controlling the same

Publication Date: 2015.04.28 MIMIRIP LLC

AI summary

A system for repairing a plurality of semiconductor chips each comprising a data storage region including electric fuses connected to the data storage regions of the plurality of semiconductor chips, a defect determination unit configured to read the data of a chip that is actually accessed and the data of an idle chip in the data storage regions, compare the actually accessed and read data with the data of the idle chip, and detect a defect based on a result of the comparison, a storage unit configured to store the defective position of the defect according to a result of the defect determination unit, and a repair unit configured to repair the defect through an E fuse connected to the position of the defect using a reset signal.