EHD Conductive Ink Printing on 3D Substrates
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Solution Overview
Problem
Existing conductive ink technologies face challenges in precisely printing conductive patterns on three-dimensional substrates, such as TFT substrates with curved or bent surfaces, due to complexity and difficulty in achieving uniform line width and pitch.
Innovation Solution
A method using electrohydrodynamic (EHD) conductive ink that applies an electric field to control ink flow, allowing for conformal printing on three-dimensional surfaces by injecting the ink through a nozzle while applying a voltage of 1 kV to 2 kV and moving at 100 mm/s to 200 mm/s, with thermal or photocuring to form precise conductive patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional printing methods are used on three-dimensional substrates, then printing can be performed, but the process becomes complicated and it is difficult to achieve uniform line width and pitch
Solution Approach 1:
The patent replaces conventional mechanical printing methods with electrohydrodynamic (EHD) printing, which uses electric fields to control inkjet ejection. This substitution eliminates the need for complex mechanical positioning and contact-based printing mechanisms, thereby simplifying the printing process while achieving uniform line width and pitch on three-dimensional substrates
Solution Approach 2:
The patent applies voltage parameters (1 kV to 2 kV) to control the ejection and deposition of conductive ink through the nozzle. By adjusting electric field parameters, the system achieves precise control over ink flow and deposition, ensuring uniform line width and pitch without complex mechanical adjustments
2Manufacturing precision
If conventional printing methods are used on three-dimensional substrates, then printing can be performed, but it is difficult to precisely print with uniform pitch
Solution Approach 1:
The patent replaces mechanical printing systems with an electric field-based EHD printing system. This substitution eliminates the need for complex mechanical positioning mechanisms required to maintain uniform pitch on three-dimensional surfaces, thereby reducing operational difficulty while achieving precise pitch uniformity
Solution Approach 2:
The patent introduces an electric field as an intermediary between the nozzle and the three-dimensional substrate. This electric field mediator controls inkjet ejection and deposition, enabling precise pitch control without direct mechanical contact or complex positioning mechanisms
3Ease of manufacture
If electrohydrodynamic ink is used to print on three-dimensional surfaces, then direct printing is enabled, but control of ink flow precision is challenging
Solution Approach 1:
The patent applies specific voltage parameters (1 kV to 2 kV) to the electrohydrodynamic system to precisely control ink flow. By optimizing these electric field parameters, the system achieves both direct printing capability on three-dimensional substrates and precise control over ink flow, resolving the contradiction between ease of manufacture and manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables direct, uniform, and efficient formation of conductive wiring on three-dimensional substrates with fine line widths, maintaining precision and conductivity through real-time line width control during EHD jetting.
Implementation Method 1
Electrohydrodynamics (EHD), first developed in the 1960s, is a field of study related to a method of controlling the flow of a liquid using an electric field
Implementation Method 2
When an electric field is applied, an electrical polarization force occurs between the electrode and the liquid, causing the fluid to move
Implementation Method 3
it is preferable that the conductive pattern is thermally or photocured after injection
Implementation Method 4
it is preferable that the conductive pattern is thermally or photocured after injection
Data Source
AI summary
The present disclosure relates to a method of forming a conductive pattern by printing a conductive ink on a substrate having a three-dimensional surface. The method includes a substrate providing step of mounting the substrate; an ink injection step of printing a conformal conductive pattern on the three-dimensional surface of the substrate by injecting a conductive ink using a nozzle while applying an electric field; and a curing step of forming the injected conductive pattern into a cured conductive pattern by curing.