EHD Dielectric Liquid Cooling for High-Density Electronic Components
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Solution Overview
Problem
Existing thermal management technologies are inefficient for heat generating components, particularly in terms of volume and energy efficiency, and there is a need for improved circulation of dielectric fluids using electrohydrodynamic principles.
Innovation Solution
An arrangement comprising an enclosure with an electrohydrodynamic flow unit, featuring offset electrodes, controls the flow of dielectric fluid within the enclosure to direct it towards or away from heat generating components, using voltage differences to manage heat transfer efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a pump unit is used to actively pump dielectric fluid onto the electronic device, then the cooling effect is improved, but the energy consumption and device complexity increase
Solution Approach 1:
The patent replaces the mechanical pump system with an electrohydrodynamic flow unit that uses electric fields to generate fluid flow. The flow unit comprises electrodes that, when voltage is applied, create electrohydrodynamic forces to circulate the dielectric fluid without mechanical moving parts, thereby reducing energy consumption and device complexity while maintaining cooling effectiveness
Solution Approach 2:
The electrohydrodynamic flow unit enables the system to self-regulate fluid circulation through electric field control. The flow can be activated or deactivated by applying or removing voltage, allowing the system to provide cooling only when needed without continuous energy input required by mechanical pumps
2Volume of moving object
If component size is reduced with higher power dissipation, then integration density is improved, but heat generation in smaller areas increases making thermal management more difficult
Solution Approach 1:
The electrohydrodynamic flow unit can be positioned and configured to target specific high-heat-generation areas on the electronic device. The flow direction and intensity can be controlled locally through electrode arrangement and voltage application, providing concentrated cooling precisely where needed rather than uniform cooling across the entire device
Solution Approach 2:
The system provides dynamic control over fluid flow characteristics through adjustable voltage application to the electrodes. This allows real-time adaptation of cooling intensity and distribution to match varying thermal loads, enabling effective thermal management of high-power-density components regardless of their size
3Ease of operation
If electrohydrodynamic flow unit is used to control fluid flow, then flow control precision is improved, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical flow control mechanisms with electric field-based control. The electrohydrodynamic flow unit uses electrodes and voltage application to control fluid flow direction and intensity, eliminating the need for mechanical valves, pumps, or actuators while achieving precise flow control through simple electrical signals
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The arrangement provides precise control over fluid flow, enhancing cooling efficiency and adaptability to various components by targeting specific areas, thus improving thermal management.
Implementation Method 1
an electrohydrodynamic, EHD, flow unit arranged within the enclosure, wherein the EHD flow unit comprises a first electrode and a second electrode arranged offset from the first electrode, and wherein the EHD flow unit is configured to control a flow of the dielectric liquid between the first electrode and the second electrode
Implementation Method 2
The flow unit may be deactivated e.g. by reducing or removing the voltage difference between the electrodes, or applying a voltage difference counteracting a flow through the flow unit
Implementation Method 3
The wall portion may be configured to be arranged in thermal contact with the heat generating component so as to allow heat to be dissipated from the heat generating component through the dielectric liquid
Implementation Method 4
the EHD flow unit is configured to control a flow of the dielectric liquid between the first electrode and the second electrode
Data Source
Figure 1~2
Figure 3a~3b
Figure 4a~4b
AI summary
An arrangement (100) for thermal management of a heat generating component is disclosed, comprising an enclosure (120) configured to accommodate a dielectric liquid (130) in thermal contact with a wall portion of the enclosure, and an electrohydrodynamic, EHD, flow unit (140) arranged within the enclosure, wherein the EHD flow unit comprises a first electrode (140a) and a second electrode (140b) arranged offset from the first electrode, and wherein the EHD flow unit is configured to control a flow of the dielectric liquid between the first electrode and the second electrode.