Modular Spatially Combined EHF Power Amplifier Architecture
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Solution Overview
Problem
Current solid-state amplifier chip technology is unable to achieve high power output (>1 W) at Extremely High Frequencies (EHF) above 200 GHz due to significant conductor losses and phase/amplitude errors in traditional combining methods, making it impractical to scale power amplifiers beyond a certain point.
Innovation Solution
A modular spatially combined power amplifier architecture that splits RF signals into multiple channels and radiates amplified power into a two-dimensional aperture in free space, using a split-block waveguide splitter and end-launched transitions to minimize losses and phase errors, allowing for efficient power combination at EHF frequencies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional corporate or radial combining networks are used to combine power from multiple amplifier chips, then the output power can be increased by adding more chips, but conductor losses and phase/amplitude errors increase causing diminishing returns and actual power decrease
Solution Approach 1:
The patent transitions from planar combining networks to three-dimensional spatial combining in free space. Multiple amplifier chips are arranged in a three-dimensional configuration where their output signals combine spatially rather than through extended conductor networks, eliminating the scaling losses that occur in traditional planar architectures.
Solution Approach 2:
The patent extracts the combining function from physical conductor networks and performs it in free space. By removing the intermediate combining network structure, the system eliminates conductor losses and reduces phase/amplitude errors that accumulate in traditional corporate or radial combining networks.
2Power
If more amplifier chips are added to traditional combining networks to increase output power, then power level increases initially, but conductor losses from increased distances and more physical splits cause power to stop increasing and actually decrease
Solution Approach 1:
The patent employs three-dimensional spatial arrangement of amplifier chips and radiating elements, allowing power combining without the need for complex planar combining networks. This dimensional transition simplifies the overall system architecture while maintaining the ability to scale power output.
Solution Approach 2:
The patent replaces the mechanical/conductor-based combining network with electromagnetic field-based spatial combining in free space. This substitution eliminates the need for physical connections and complex network structures, reducing both complexity and losses.
3Adaptability or versatility
If W-band modular spatial combining design is used at EHF frequencies, then the architecture provides a starting point, but increased conductor losses at higher frequencies make the design inadequate and prevent scaling to EHF band
Solution Approach 1:
The patent modifies the spatial combining parameters specifically for EHF frequencies, including optimizing the three-dimensional arrangement of radiating elements and adjusting element spacing to account for the shorter wavelengths at EHF band. This allows the architecture to scale from W-band to EHF while maintaining low loss performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables high output power at EHF frequencies with minimal conductor losses and reduced phase/amplitude errors, effectively overcoming the limitations of traditional combining methods and achieving power levels greater than 1 W.
Implementation Method 1
L chip-to-waveguide end-launched transitions are configured to overhang into the L output waveguides, respectively, for an end launch coupling of the output waveguide to the chip input parallel to the chip in the X-Y plane
Implementation Method 2
L solid-state amplifier chips having an operating wavelength λ are mounted on the surface of the heat sink... radiate the amplified power into a two-dimensional aperture in free space where the power is spatially combined
Data Source
AI summary
A power amplifier uses a modular architecture in which each of the one or more modules spatially combines the power from multiple amplified channels. The individual modules are configured to operate in the EHF band and above at low loss. This entails reconfiguring the input and output splitters, the end-launched transitions between the amplifier chips and the input and output splitters and the packaging of the DC power and control board. The input splitter uses a split-block technology. The output splitter maps each amplified channel into a two-dimensional aperture.